Everett Charles launches RF probes for semiconductor test

October 9, 2014. Everett Charles Technologies (ECT) has launched the Z0 and Z1 probes—two new members of the ZIP probe family designed to meet signal-integrity challenges driven by the ever increasing speed of semiconductor devices.

Tony DeRosa, senior product manager, pointed out, “While conventional round-probe technology restricts travel and only allows for a small internal contact area, ZIP based on ECT’s flat technology offers generous travel and a large contact area. The result is excellent electrical performance for the critical parameters of bandwidth, contact resistance, and current capacity. The manufacturing processes used to fabricate ZIP probes are extremely repeatable and stable, ensuring probe-to-probe consistency. We have over four decades of spring probe engineering experience. Our patented, innovative flat probe technology optimizes electrical and mechanical performance. ECT offers ZIP™ in two high performance versions: Z1 and Z0.”

Z1 is ECT’s high-bandwidth series with a test height of 2.7 mm. It offers an insertion loss of approximately -1 dB 30 at GHz. Z0 is ECT’s ultra-high bandwidth series. Z0’s short test height of 1.5 mm and 0.60 nH of inductance provides an insertion loss of -1 dB at 40 GHz. The probes are available for semiconductor packages with a pitch down to 0.4 mm and are applicable for a wide range of RF testing of applications from lab and characterization to burn-in and high volume final test.


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