October 17, 2013. LPKF Laser & Electronics has announced the availability of a new, higher-powered laser source option for its MicroLine family of UV laser circuit board depaneling systems. LPKF continues to offer its existing 6-W laser source, but now all MicroLine depaneling systems can be alternatively equipped with a 12-W power source.
“A 6-W power source is ideal for working with thinner materials such as flex or rigid-flex materials,” said LPKF sales engineer Mirela Orlowski. “In contrast, the new 12-W power source provides great efficiency when working with thicker materials such as 62-mil (1.57-mm) FR4.”
The MicroLine family of systems consists of three series (the 1000, 2000, and 6000), which accommodate various application sizes and production quantities.
UV laser processing is a low-stress alternative to mechanical PCB depaneling methods such as routing or dicing. By using a virtual tool as opposed to a physical one, effects of stress such as burring and damaged components are eliminated.