ASMC to address fab productivity and process technologies

March 12, 2014. The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, NY. The conference will feature 37 hours of technical presentations and more than 90 speakers covering all aspects of advanced semiconductor manufacturing.

This year’s event features a panel discussion on “25 Years of Semiconductor Manufacturing: Accomplishments, Current Challenges, Future Directions—From the Internet to the Internet of Things,” with panelists from SEMATECH, Rochester Institute of Technology, GLOBALFOUNDRIES, Qualcomm, and Applied Materials. Also featured will be s tutorial on directed self-assembly taught by Michael A. Guillorn, Ph.D., from the Nanofabrication and Electron Beam Lithography department at the IBM T.J. Watson Research Center, and a second tutorial, on Silicon Photonics, taught by Dr. Haisheng Rong, Intel.

Celebrating 25 years of manufacturing excellence in 2014, the SEMI Advanced Semiconductor Manufacturing Conference provides a venue for industry professionals to network, learn, and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The 2014 conference is co-chaired by Israel Ne'eman, Applied Materials, and Oliver Patterson, IBM Microelectronics. ASMC 2014 offers keynote talks by Dr. Been-Jon Woo from TSMC and Dean Freeman from Gartner.

The topical areas ASMC 2014 speakers and poster presenters will address include

  • 3D/TSV
  • Advanced Equipment and Materials
  • Advanced Metrology
  • Advanced Patterning/Design for Manufacturing
  • Advanced Process Control (APC)
  • Contamination Free Manufacturing (CFM)
  • Data and Yield Management; Defect Inspection
  • Equipment Reliability and Productivity Enhancement
  • Factory Optimization
  • Yield Enhancement.

ASMC also holds an interactive poster session and reception, which provides an ideal opportunity for networking between authors and conference attendees. During this session, participants can engage authors in in-depth discussion of a wide range of issues. 

ASMC 2014 is presented by SEMI with technical sponsors: Institute of Electrical & Electronics Engineers (IEEE); IEEE Electron Devices Society (EDS); and IEEE Components, Packaging and Manufacturing Technology Society (CPMT).  Corporate sponsors include Applied Materials; ASML; ChemTrace; CNW Courier Network; Edwards Vacuum; Greene, Tweed;  KLA-Tencor; Lam Research; Marcy NanoCenter; NY Loves Nanotech; and Saratoga Convention and Tourism Bureau.

www.semi.org/asmc2014

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