Written by Engineers …for Engineers

IPC North American EMS and PCB statistical programs open

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Bannockburn, IL. IPC’s North America statistical programs for the rigid PCB, flexible circuit, and contract electronics manufacturing (EMS) industries are now open to new participants for 2017. The deadline for IPC members to sign up is February 3. Participation is free to IPC member...

Circuit Check and ASSET InterTech collaborate on boundary-scan test

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Minneapolis, MN. Circuit Check Inc., a global provider of test, automation, and interfacing solutions for electronics and electromechanical device manufacturers, announced a collaboration with ASSET InterTech to more closely integrate ASSET’s ScanWorks boundary-scan test tools with CCI’s flexible, configurable, functional test systems, the CCI...

Multichannel LXI digitizers deliver high-resolution measurements

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Hackensack, NJ. Spectrum Instrumentation Corp. has released a range of high-speed 14- and 16-bit LXI-based digitizer products for applications where multiple electronic signals need to be acquired and analyzed. Twelve new instruments with up to 24 fully synchronized channels extend Spectrum's digitizerNETBOX family. The 16-bit...

IPC APEX EXPO 2017 offers networking opportunities

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Bannockburn, IL. IPC APEX EXPO 2017 attendees can network with industry colleagues, make new connections, and interact with more than 450 exhibitors in one place at one time in San Diego February 14-16. From the exhibit floor to the classroom and everywhere in between—including the...

North American PCB book-to-bill ratio falls, sales growth resumes

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Bannockburn, IL. IPC-Association Connecting Electronics Industries has announced the November 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio fell below parity, to 0.99, while sales resumed slow but positive growth in November. Total North American PCB...

From USB 3.1 to 400GbE, data rates push limits

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As engineers pursue high-speed serial-bus, backplane, memory-interface, and network designs, they face significant challenges relating to a variety of interfaces and standards, including USB 3.1, Thunderbolt 3, DisplayPort, HDMI, PCIe, DDR4/DDR5, InfiniBand, RapidIO, JESD204B, SAS, and OIF-CEI-56G as well as Ethernet speeds to 400G....

High or low density matters

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Thanks to advances in relay and semiconductor capabilities, switching systems continue to evolve. Higher performance relays are available with the same or smaller size footprint as older devices, making them attractive when greater density is appropriate. Pickering Interfaces’ Shaun Fuller, switching product manager, said, “Compared...

A full life-cycle view of automotive test

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Only a few years ago, the top factors when deciding which car to buy included horsepower, fuel economy, and the number of cup holders. Today, car buyers are more concerned with battery size, safety features like lane change assist, and how well their smartphone...

Scan ATPG and compression are beating Moore’s law

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Moore’s law has been the standard reference for semiconductor scaling. It roughly says that semiconductor design sizes, fueled by technology improvements, double every two years. Consequentially, the complexity of designing and fabricating semiconductors continues to grow, requiring increasing efforts and larger design teams. It...

Jabil posts first-quarter net revenue of $5.1 billion

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Yesterday Jabil Circuit Inc. reported preliminary, unaudited financial results for its first quarter of fiscal year 2017, including first-quarter net revenue of $5.1 billion. “I'm really pleased with our strong first quarter results,” said CEO Mark Mondello in a press release. “In particular, we saw...