Written by Engineers …for Engineers

From USB 3.1 to 400GbE, data rates push limits

As engineers pursue high-speed serial-bus, backplane, memory-interface, and network designs, they face significant challenges relating to a variety of interfaces and standards, including USB...

Instrument and chip vendors boost high-frequency test

The closing quarter of 2016 saw a variety of RF/microwave technology innovations. The European Microwave Week (EuMW), held Oct. 4-6 in London, was the...

High or low density matters

Thanks to advances in relay and semiconductor capabilities, switching systems continue to evolve. Higher performance relays are available with the same or smaller size...

3D printing drives automotive innovation

There can be little doubt that additive manufacturing has become an important capability for automotive companies. A 2016 white paper1 addresses “Five ways 3D...

A full life-cycle view of automotive test

Only a few years ago, the top factors when deciding which car to buy included horsepower, fuel economy, and the number of cup holders....

Tools span software to amplifiers

This sampling of products for implementing and testing compliance with EMC requirements ranges from software tools to high-frequency, high-power amplifiers. Software tools include Modelithics’...

Mitigating medical device risk

What is the proper level of security for today’s medical devices? Given their large electronic and software content and the value of medical information,...

Test adds value as Moore’s Law recedes

The semiconductor industry is facing severe challenges. Moore’s Law, encountering economic pressures and physical limits, will not continue much longer. With the end of...

EE – Janaury 2017 Product Picks

High-speed DC load The EL 2000 HS (high-speed) electronic DC load is the latest addition to the vendor’s family of power-system ATE. The EL 2000...