IPC International Technology Roadmap Takes New Directions

March 28, 2013. The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that is occurring throughout the electronics industry: more cooperation and information sharing.

Published biennially in CD format, the nearly 600-page guide to interconnect technology trends was developed with input from subject-matter experts around the globe. Noting the increase in shared information, Jack Fisher, president of Interconnect Technology Analysis Inc. and chairman of the IPC Roadmap Executive Committee, said, “There was quite a bit of exchange between a number of electronics industry groups; we were focused on providing the best information for our respective constituencies with less concern on where the facts originated.”

The 2013 roadmap incorporates data and comparisons to help users serve clients and/or guide their companies in identifying, selecting and developing the right technology alternatives to create the products needed for future markets.

One of the significant changes is a greatly expanded section on printed electronics focusing on more realistic opportunities and challenges of the technology. “Printed electronics has emerged as another viable option for some products,” Fisher added.

Another change within the 2013 roadmap can be found in the environmental section, renamed the “stewardship” section. “Consumers have long embraced the green movement, which prompted changes in the way companies view related environmental issues,” said Marc Carter, IPC director of technology transfer.  “Market-savvy companies, in turn, can embrace these environmental issues as opportunities.”

In addition, the roadmap includes technical presentations made by industry experts within a special resource section used by the roadmap developers to provide predictions and visionary descriptions.

Though the IPC roadmap focuses on technology, it also addresses shifts in the business environment. The 2013 roadmap has an updated and expanded section addressing the changes in business models and expectations between OEMs, ODMs, EMS providers, and fabricators, and the rise of contractor specialists for previously internal functions.

As the Roadmap Committee embarks on the development of the 2015 edition, the group invites anyone interested in helping make each successive release more comprehensive to join in its efforts. For details on getting involved, contact Marc Carter at MarcCarter@ipc.org.

IPC members may purchase 2013 IPC International Technology Roadmap for Electronic Interconnections for $125; the standard industry price is $250.

www.ipc.org/roadmap

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