White Papers

The Future of In-Circuit Testing in the High-Speed, Complex Electronics Environment

As board complexity and node counts continue to rise and high-speed differential signaling to grow in popularity, in-circuit test needs to move quickly beyond the traditional realms.

PCI Express Performance Measurements

Performance always depends on the efficiency of both devices on a PCI Express link. Parameters like payload size, flow control credit availability, and different latencies strongly influence the overall result.

A Comparison of Methods for Estimating Total Jitter Concerning Precision, Accuracy and Robustness

An evaluation using spectral and statistical techniques provides results for both real and simulated measurement scenarios and insight into the weaknesses and strengths of the various methods.

Top 10 Things to Consider When Selecting a Digitizer/Oscilloscope

One of the most significant transformations of the oscilloscope is its transition into the digital domain, which enables powerful features such as digital signal processing and waveform analysis.

Strategies for Signal Intelligence: From Antennas to Analysis

Signal intelligence describes a broad range of applications ranging from communications jamming, packet sniffing, and identification of interference or pirating signals.

Embedded Design Techniques for Optimizing Control Parameters

In the process of optimizing control functions, small adjustments in microcontroller firmware can produce significant improvements in embedded system performance.

Measuring Dynamic Performance

This white paper describes the importance of AC specifications when measuring dynamic performance.

The Battle for Data Fidelity: Understanding the SFDR Spec

The key to properly interpreting this specification lies in understanding the sources of spurious signals and how SFDR is measured.

Exploring the Necessity of the Hot Hipot Test

The mere mention of hot hipot test can bring about feelings of apprehension. But with a basic understanding of a hipot test setup, it is relatively easy to understand, implement, and perform a hot hipot test.

Lead-Free Assembly Shifts Test Methods Toward Boundary Scan

Worldwide the move is on to eliminate pollution-causing lead from the PCB manufacturing process. The effects of getting the lead out on electronic test and the use of JTAG test techniques are discussed.