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"ATE"


Vietnam Semiconductor Strategy Summit highlights announced

By Rick Nelson on August, 2014 [0]
SEMI has announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit (September 16-17), a conference focused on Vietnam's role in the global semiconductor industry.
Other Tags:  News 

SEMI looks to future challenges, welcomes STEM initiative

By Rick Nelson on July, 2014 [0]
SEMICON West kicked off with several key announcements relating to workforce development, industry outlook, and SEMI governance. In addition, SEMI presented a panel discussion on technical challenges.
Other Tags:  Key Technologies 

Collaboration will drive innovation

By Rick Nelson, Executive Editor on September, 2014 [201409]
Collaboration will be increasingly important in moving technology forward, as was made clear by many speakers at SEMICON West 2014.
Other Tags:  Key Technologies 

Board test in a repair depot: bridging past and future

By Luca Corli, Worldwide Sales Manager, Seica SpA on August, 2014 [0]
If you're used to a manufacturing environment, board test in a repair depot will look very different.
Other Tags:  Military / Aero Test 

IPC releases PCB industry results for July 2014

By Rick Nelson on August, 2014 [0]
North American PCB Business Reflects Normal Seasonal Slowdown
Other Tags:  News 

KLA-Tencor debuts systems for patterning control

By Rick Nelson on August, 2014 [0]
KLA-Tencor introduces key systems for 5D patterning control solution, accelerating the ramp of advanced patterning techniques for sub-20-nm design nodes
Other Tags:  News 

SEMICON Europa to offer power-related technical forums

By Rick Nelson on August, 2014 [0]
Energy Efficiency Electrifies SEMICON Europa: Low Power and Power Electronics
Other Tags:  Key Technologies 

Murata to acquire Peregrine Semiconductor

By Rick Nelson on August, 2014 [0]
Murata to Acquire Peregrine Semiconductor for $12.50 Per Share in Cash; Acquisition enhances Murata's position as a world's leading provider of RF system solutions
Other Tags:  Key Technologies 

SEMI posts July 2014 book-to-bill ratio of 1.07

By Rick Nelson on August, 2014 [0]
North American Semiconductor Equipment Industry Posts July 2014 Book-to-Bill Ratio of 1.07
Other Tags:  News 

Leveraging military and commercial test technology

By Rick Nelson, Executive Editor on September, 2014 [201409]
Exhibitors at the military-focused AUTOTEST comment on the use of their products in aerospace, energy, transportation, medical, and related markets.
Other Tags:  Instrumentation 

IMS, SEMICON West see IoT emphasis

By Rick Nelson, Executive Editor on September, 2014 [201409]
The focus of IMS and SEMICON West may differ in technologies and industries, but both events emphasized one topic—the Internet of Things.
Other Tags:  Communications Test 

IPC simplifies comparison of lead-free solder alloys

By Rick Nelson on August, 2014 [0]
The proliferation of lead-free solder alloys gives users a wide range of features, but it can be difficult to figure out which of these alloys provides the best match for product requirements.
Other Tags:  News 

Averna and JOT Automation announce technology partnership

By Rick Nelson on August, 2014 [0]
Averna and JOT Automation Announce a Technology Partnership for the Americas; Collaboration Strengthens Market-Leading Technologies in Automation and Test Solutions for Electronics Device Makers
Other Tags:  News 

SEMI addresses Taiwan market

By Rick Nelson on August, 2014 [0]
SEMICON Taiwan 2014 to Capitalize on Growing Market Opportunities in Taiwan; Planning for Record Attendance
Other Tags:  Key Technologies 

NIWeek at 20: providing an assist to hundreds of thousands of new products

By Rick Nelson on August, 2014 [0]
National Instruments today kicked off its annual NIWeek event with several significant product introductions, spanning manufacturing test to field data acquisition.
Other Tags:  Software 

NA semiconductor equipment industry posts 1.09 book-to-bill ratio

By Rick Nelson on July, 2014 [0]
North American Semiconductor Equipment Industry Posts June 2014 Book-to-Bill Ratio of 1.09.
Other Tags:  News 

SEMI announces South America semiconductor strategy summit

By Rick Nelson on July, 2014 [0]
First SEMI Event in Latin America Set for November in Buenos Aires, Argentina
Other Tags:  News 

SEMI Strategic Materials Conference begins September 30

By Rick Nelson on July, 2014 [0]
The conference theme is Materials Matter-Enabling the Future of IC Fabrication and Packaging
Other Tags:  Key Technologies 

Cemtrex receives orders totaling over $7 million

By Rick Nelson on July, 2014 [0]
Cemtrex has recently received orders in excess of $7 million across its business divisions: environmental monitoring and systems, and electronic manufacturing services.
Other Tags:  Medical Test 

SEMICON Europa event to explore rise of imaging systems

By Rick Nelson on July, 2014 [0]
Imaging Without Limits: Phones Lead Growth but Innovative Applications Expanding the Market
Other Tags:  Inspection 

Qualcomm exec talks IoT, says ATE won't be free

By Rick Nelson on July, 2014 [0]
Speaking at Test Vision 2020 held in conjunction with SEMICON West, Michael Campbell, senior vice president at Qualcomm Technologies Inc., noted that the IoT promises vast opportunities and challenges.
Other Tags:  Key Technologies 

EAG touts capabilities at SEMICON West

By Rick Nelson on July, 2014 [0]
Representatives of the Evans Analytical Group were on hand at SEMICON West to highlight their company's capabilities for the semiconductor industry.
Other Tags:  Ricks Blog 

Advantest adds T2000, V93000 modules

By Rick Nelson on July, 2014 [0]
Advantest at SEMICON West demonstrated that it is supporting both its T2000 and V93000 test platforms.
Other Tags:  Communications Test 

KLA-Tencor addresses IC manufacturing challenges at SEMICON West

By Rick Nelson on July, 2014 [0]
KLA-Tencor chose SEMICON West to announce four new systems-the 2920 Series, the Puma 9850, the Surfscan SP5, and the eDR-7110.
Other Tags:  Key Technologies 

SEMICON West keynoter emphasizes partnerships

By Rick Nelson on July, 2014 [0]
Partnerships are the key to furthering the success of the semiconductor industry, according to Mark Adams, president of Micron.
Other Tags:  Communications Test 

Van den hove calls for collaboration at ITF

By Rick Nelson on July, 2014 [0]
Precompetitive collaboration will be the key to innovation in the semiconductor industry as fewer companies cooperate to share costs and risks.
Other Tags:  Key Technologies 

Global semiconductor sales increase across all regions in May

By Rick Nelson on July, 2014 [0]
Americas show strongest year-over-year growth; global sales remain well ahead of 2013 pace
Other Tags:  News 

SEMI forecasts double-digit growth in equipment spending

By Rick Nelson on July, 2014 [0]
SEMI forecasts back-to-back years of double-digit growth in chip equipment spending
Other Tags:  News 

IPC applauds new U.S. rule for military-related PCBs

By Rick Nelson on July, 2014 [0]
IPC is applauding the U.S. Department of State's final rule for Category XI for Military Electronics of the United States Munitions List (USML).
Other Tags:  Military / Aero Test 

MAC Panel debuts APEX connector

By Rick Nelson on June, 2014 [0]
MAC Panel introduced a -high performance electrical connector, APEX, aimed at providing customers with stronger contacts and better overall reliability.
Other Tags:  News 

Technology breakthroughs featured at SEMICON West

By Rick Nelson on June, 2014 [0]
"What Comes Next?" - Latest Technology Breakthroughs Featured at SEMICON West
Other Tags:  Key Technologies 

Koh Young to unveil HORUS 3-D measurement system

By Rick Nelson on June, 2014 [0]
Koh Young Unveils New HORUS 3D Measurement for Semiconductor Applications at SEMICON West 2014
Other Tags:  Inspection 

Programmable power supply output extends to 650 V

By Rick Nelson on June, 2014 [0]
TDK Corp. has announced the introduction of high-voltage models in the TDK-Lambda Z+ series of 200-W and 400-W programmable DC power supplies.
Other Tags:  Instrumentation 

SEMI posts May book-to-bill ratio

By Rick Nelson on June, 2014 [0]
North American Semiconductor Equipment Industry Posts May 2014 Book-to-Bill Ratio of 1.00
Other Tags:  News 

Xcerra's Tacelli to join panel discussion at Semicon West

By Rick Nelson on June, 2014 [0]
Xcerra President and CEO Dave Tacelli to Join Panel Discussion at Semicon West Panel 'Testing the Future' hosted by CAST
Other Tags:  News 

16-Channel, 16-bit DAC drives 10-mA, 1,000-pF loads

By Rick Nelson on June, 2014 [0]
Linear Technology has introduced the LTC2668-16, a 16-channel, 16-bit voltage output digital-to-analog converter (DAC) with SoftSpan outputs, each of which can be independently configured
Other Tags:  News 

R&S SGT100A vector signal generator offers fast production test

By Rick Nelson on June, 2014 [0]
Rohde & Schwarz presents its new R&S SGT100A vector signal generator operating up to 6 GHz, specially optimized for use in production test systems.
Other Tags:  Communications Test 

Critical test issues up for debate at Test Vision 2020

By Rick Nelson on June, 2014 [0]
Discussion to revolve around IoT's impact on test, along with other key test issues
Other Tags:  Instrumentation 

Agilent teams with Cascade on wafer measurement

By Rick Nelson on June, 2014 [0]
Agilent and Cascade at IMS announced a strategic alliance to provide fully configured and validated wafer-measurement capabilities.
Other Tags:  Communications Test 

Xcerra embraces PCB and semiconductor test entities

By Rick Nelson on May, 2014 [0]
LTX-Credence, Multitest, Everett Charles Technologies, and atg Luther & Maelzer will henceforth operate as Xcerra Corp.
Other Tags:  News 

ASSET and Synopsys collaborate on IEEE P1687 IJTAG

By Rick Nelson on May, 2014 [0]
ASSET and Synopsys collaborate on proof-of-concept demonstrating an IEEE P1687 IJTAG tools flow; EDA Tools ecosystem for new IJTAG embedded instruments standard explained in case study
Other Tags:  Software 

KLA-Tencor debuts Teron SL650 reticle inspection system

By Rick Nelson on May, 2014 [0]
High productivity and 193-nm technology facilitate cost-effective IC fab reticle monitoring for sub-20-nm design nodes
Other Tags:  News 

Rudolph touts installations of its process control software

By Rick Nelson on May, 2014 [0]
Following a record number of Yield Management Software installations, Rudolph experiences increased demand for its Advanced Process Control Software as it becomes critical to customers in maintaining yield during high-volume manufacturing
Other Tags:  Software 

Increase seen in Q1 2014 silicon wafer shipments

By Rick Nelson on May, 2014 [0]
Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group.
Other Tags:  News 

Global semiconductor industry posts highest ever first-quarter sales

By Rick Nelson on May, 2014 [0]
March sales up 11.4% compared to last year; year-to-year sales increase across all regions
Other Tags:  News 

PXI Express hybrid chassis addresses high-power ATE

By Rick Nelson on May, 2014 [0]
Self-Monitoring 18-Slot PXI Express Hybrid Chassis Addresses High Power ATE System Requirements
Other Tags:  Instrumentation 

Software for Questa enables early verification of IEEE 1149.1-2013

By Rick Nelson on May, 2014 [0]
New Software for Mentor Graphics Questa Platform Enables Early Verification of IEEE 1149.1-2013 Compliant IP and On-chip Instruments
Other Tags:  Software 

North American PCB book-to-bill ratio turns positive

By Rick Nelson on April, 2014 [0]
IPC Releases PCB Industry Results for March 2014
Other Tags:  News 

Transitioning from Design Validation to Production Test

By Skip Davis, Applicos NA on April, 2014 [0]
The need to correlate design and production test results can be supported by using a modular approach to mixed-signal testing.
Other Tags:  Key Technologies 

Mixed-Domain Oscilloscopes Go Mainstream

By Rick Nelson, Executive Editor on May, 2014 [201405]
Mixed-signal embedded designs need three domains, prompting Tektronix to offer scopes with access to analog, logic, and RF capabilities.
Other Tags:  Software 

Symposium at SEMICON West to spotlight critical issues

By Rick Nelson on April, 2014 [0]
New Technology Symposium at SEMICON West 2014 to Spotlight Critical Issues in Semiconductor Manufacturing
Other Tags:  Instrumentation 

SEMI posts March book-to-bill ratio of 1.06

By Rick Nelson on April, 2014 [0]
North American Semiconductor Equipment Industry Posts March 2014 Book-to-Bill Ratio of 1.06
Other Tags:  News 

OptimalTest becomes Optimal+

By Rick Nelson on April, 2014 [0]
Corporate name change reflects the expanding focus of the company's solutions beyond traditional test management into Manufacturing Intelligence
Other Tags:  Software 

IPC releases "Conflict Minerals Data Exchange Standard"

By Rick Nelson on April, 2014 [0]
IPC-1755 Establishes Requirements for Suppliers and their Customers
Other Tags:  Key Technologies 

JOT introduces vision inspection cell

By Rick Nelson on March, 2014 [0]
JOT introduces a vision inspection cell for verification of various display and camera functionalities enabling parallel testing with multiple cameras
Other Tags:  Inspection 

GIA reports chip manufacturing drives demand for ATE

By Rick Nelson on March, 2014 [0]
GIA reports market for Semiconductor ATE is forecast to reach $4.3 billion by 2020, spurred by chip fabrication activity against a backdrop of growing demand for electronic chips in consumer, industrial, automotive and medical electronics.
Other Tags:  Instrumentation 

GOEPEL automates differential-clock embedded test

By Rick Nelson on March, 2014 [0]
Concurrent with the IPC APEX EXPO, GOEPEL electronic, a vendor of IEEE1149.x-compliant JTAG/boundary-scan solutions, announced the extension of the ChipVORX embedded test instruments for universal frequency measurement based on special FPGA soft macros.
Other Tags:  Instrumentation 

Semiconductor Vendors Mine Big Data for Quality

By Rick Nelson, Executive Editor on April, 2014 [201404]
The semiconductor manufacturing industry is driving toward higher quality, said David Park, vice president of OptimalTest.
Other Tags:  Software 

OptimalTest Release 5.5 drives semiconductor quality

By Rick Nelson on March, 2014 [0]
End-to-end software solution significantly improves Part Average Test, automatic ATE configuration management and product traceability for better RMA management.
Other Tags:  Software 

IPC APEX EXPO convenes in Las Vegas

By Rick Nelson on March, 2014 [0]
Sponsoring organization IPC said the exhibit hall will host 440 companies, including 57 first-time exhibitors, showcasing new technologies, products, materials, and services for the electronics manufacturing industry. Exhibitors will introduce more than 300 new products.
Other Tags:  Inspection 

SEMICON Singapore to address mobility for IoT

By Rick Nelson on March, 2014 [0]
SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).
Other Tags:  Communications Test 

SEMI recognizes SMIC CEO on environment, health, safety

By Rick Nelson on March, 2014 [0]
SEMI Recognizes SMIC CEO TY Chiu for Environment, Health and Safety Leadership
Other Tags:  Key Technologies 

XJTAG and Agilent unveil XJLink2 3070

By Rick Nelson on March, 2014 [0]
XJTAG, a supplier of boundary-scan technology, released the XJLink2 3070, which provides convenient, integrated access to XJTAG's test and programming tools from Agilent i3070 ICT machines.
Other Tags:  Instrumentation 

Silicon Innovation Forum to Expand in 2014

By Rick Nelson on March, 2014 [0]
Program Focused on Connecting Early-Stage Companies with Strategic Investors and VCs to Expand to Europe-as Second SIF Gears Up for SEMICON West 2014
Other Tags:  News 

ASMC to address fab productivity and process technologies

By Rick Nelson on March, 2014 [0]
Manufacturers, suppliers and academia to celebrate 25 years of semiconductor manufacturing at SEMI event
Other Tags:  News 

SEMI releases 2013 global semiconductor equipment sales

By Rick Nelson on March, 2014 [0]
SEMI Reports 2013 Global Semiconductor Equipment Sales of $31.6 Billion
Other Tags:  News 

Rudolph Ships TSV Metrology System to CEA-Leti

By Rick Nelson on March, 2014 [0]
First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration
Other Tags:  Key Technologies 

Semiconductor companies ready for 3-D TSV ICs

By Rick Nelson on March, 2014 [0]
Semiconductor companies are ready for 3-D TSV ICs, but applications are not, say participants at the European 3D TSV Summit
Other Tags:  Key Technologies 

Global Semiconductor Industry Posts Record January Sales

By Rick Nelson on March, 2014 [0]
Year-to-year global sales increase by largest margin in nearly three years; sales in Americas up 17.3% compared to last January
Other Tags:  News 

XJTAG Release Supports Repair Market

By Rick Nelson on March, 2014 [0]
XJTAG 3.2 development system extends the concept of boundary-scan testing to allow engineers to test boards where they do not have access to a netlist.
Other Tags:  Software 

University of Twente Using ProChek

By Rick Nelson on February, 2014 [0]
Ridgetop Group's Advanced Instrument Supporting CMOS Process Reliability Study to Explore IC Wear-Out Mechanisms
Other Tags:  News 

Debug and Trace Tool Supports ThreadX Operating System

By Rick Nelson on February, 2014 [0]
ASSET's SourcePoint debug and trace tool now supports ThreadX operating system, provides greater visibility into multithreaded code execution, and accelerates software debug
Other Tags:  Software 

Fix the Process, Not Just the Product

By Mary Elmallakh, M. Sc., and Paul Groome, Digitaltest; and Andy Shelton, Pulse Communications on February, 2014 [0]
Quality management solutions integrate real-time test and inspection with engineering and production data to optimize the manufacturing process.
Other Tags:  Instrumentation 

Presto Engineering to Participate in MACSPACE Consortium

By Rick Nelson on February, 2014 [0]
The MACSPACE consortium is focused on developing high-performance computer processors for use in space.
Other Tags:  Communications Test 

Foxconn looks to Google for robot help

By Rick Nelson on February, 2014 [0]
Contract manufacturer Foxconn is looking to Google for help in deploying robots in its factories.
Other Tags:  Communications Test 

Agilent Technologies Offers PCB Analyzer

By Rick Nelson on February, 2014 [0]
Agilent Technologies Inc. has introduced the E5063A PCB Analyzer for printed-circuit-board impedance test in manufacturing.
Other Tags:  Communications Test 

Peak Group Offers VPC Mass InterConnect Contacts

By Rick Nelson on February, 2014 [0]
Now available in the UK from the Peak Group are a range of high-power contacts for the Mass InterConnect systems produced by Virginia Panel Corp. (VPC).
Other Tags:  Automotive/Vehicle Test 

Test Innovations for ISO 26262

By Steve Pateras, Mentor Graphics Silicon Test Solutions on January, 2014 [0]
Automotive safety features are experiencing large growth, and the move toward autonomous vehicles promises to even further increase the number.
Other Tags:  Automotive/Vehicle Test 

The Fourth Industrial Revolution Brings Challenges to Big Data

By Rick Nelson on January, 2014 [0]
Industry 4.0 faces a major challenge before it can live up to its promise, according to a new white paper from IHS Technology.
Other Tags:  Communications Test 

EC Pursues Semiconductor Manufacturing 20% Share by 2020

By Rick Nelson on January, 2014 [0]
ISS Europe to explore trends, market opportunities, critical technologies and associated risks to help drafting strategic business plans, in light of the EC initiative
Other Tags:  News 

AOI System Doubles Inspection Speed

By Rick Nelson on January, 2014 [0]
GOEPEL electronic OptiCon with Turbo offers inspection time reduction of up to 50%.
Other Tags:  Inspection 

S530 Parametric Test System Gets Software Upgrade

By Rick Nelson on January, 2014 [0]
Keithley's S530 parametric test system now offers comprehensive system diagnostics, expanded measurement functions, larger instrument cabinet
Other Tags:  Software 

Astronics to Acquire EADS North America Test and Services

By Rick Nelson on January, 2014 [0]
Astronics Corp. announced that it has entered into a definitive agreement to acquire substantially all of the assets and liabilities of EADS North America's Test and Services Division.
Other Tags:  Communications Test 

Making chips and shoes in U.S. factories

By Rick Nelson on January, 2014 [0]
Although many offshored jobs will not return, U.S. manufacturing is in good shape, according to Donald B. Rosenfield, a senior lecturer at the MIT Sloan School of Management.
Other Tags:  Ricks Blog 

Platform-Based Design and Test in a Programmable World

By Rick Nelson, Executive Editor on February, 2014 [201402]
National Instruments Fellow Mike Santori describes how our world has transformed into a huge programmable system called the Internet of things.
Other Tags:  Software 

SEMI Reports Shift in Capacity, Equipment Spending Trends

By Rick Nelson on January, 2014 [0]
Based on SEMI World Fab Forecast data, SEMI suggests that spending trends for the semiconductor industry have changed.
Other Tags:  News 

Koh Young Reports Growth, Increased Market Share

By Rick Nelson on December, 2013 [0]
Koh Young Technology said it has strengthened its position in the high and mid-range segments of the 3-D AOI market and increased its sales revenue.
Other Tags:  Inspection 

Presto Engineering Launches New Test Production Center

By Rick Nelson on December, 2013 [0]
Integrated semiconductor engineering, including qualification, failure analysis, production and turnkey services, can now be obtained from a single supplier.
Other Tags:  Software 

SEMI Issues SEMICON West Call for Papers

By Rick Nelson on December, 2013 [0]
SEMI issued a call for papers for the Semiconductor Technology Symposium, the TechXPOT programs, and a Science Park program featuring university research at SEMICON West.
Other Tags:  Inspection 

Agilent Software Adopted by Microchip Technology

By Rick Nelson on December, 2013 [0]
Agilent Technologies' Model Extraction and Qualification Software Adopted by Microchip Technology for PDK Creation, Modification, Validation
Other Tags:  Software 

Qualcomm To Assess CEA-Leti Sequential 3D Technology

By Rick Nelson on December, 2013 [0]
CEA-Leti announced an agreement with Qualcomm to assess the feasibility and the value of Leti's sequential 3D technology.
Other Tags:  News 

Digicom Provides Medical Device Manufacturing Services

By Rick Nelson on December, 2013 [0]
Digicom Electronics Provides Medical Device Companies with Complete Solutions from Design for Manufacturing to Fully Integrated Box Build
Other Tags:  Medical Test 

SEMI Forecasts Semiconductor Equipment Growth for 2014

By Rick Nelson on December, 2013 [0]
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3% to $32.0 billion in 2013.
Other Tags:  News 

Module Kit Handles Gang Parallel Test and Programming

By Rick Nelson on December, 2013 [0]
GOEPEL extended SCANFLEX by adding SFX Gang Test Module Kit for parallel test and programming of 32 different assemblies with a mass-interconnect interface from Virginia Panel.
Other Tags:  Instrumentation 

Mercury Contactor Cuts Cost of Test by 25%

By Rick Nelson on December, 2013 [0]
Multitest said its Mercury 040 spring probe contactor has passed more than five months of evaluation for a strip-test application at a South East Asia.
Other Tags:  News 

GOEPEL Enhances RAPIDO Inline Systems

By Rick Nelson on November, 2013 [0]
GOEPEL announced new features in the RAPIDO multisite inline production system for high-speed in-system programming and board test based on ESA.
Other Tags:  News 

Magna-Power Offers High Voltage DC Power Supplies

By Rick Nelson on November, 2013 [0]
Magna-Power announced the expansion of its XR Series product line, now offering models at 2 kV, 4 kV, 6 kV, 8 kV, and 10 kV at 2 kW, 4 kW, 6 kW, and 8 kW in a 2U rack-mount package.
Other Tags:  Instrumentation 

ECT Offers ZIP Z0 and Z1 Contacts in HyperCore Base Material

By Rick Nelson on November, 2013 [0]
Everett Charles Technologies announced that the 0.4-mm and 0.5-mm ZIP Z0 and Z1 production contacts are now available in the high-performance HyperCore base material.
Other Tags:  News 

Rudolph Wins Orders for AWX Unpatterned Wafer Inspection Tools

By Rick Nelson on November, 2013 [0]
For back-end and advanced packaging applications, AWX system combines the sensitivity, speed, and data analysis needed to optimize back-end processes and minimize cost.
Other Tags:  Inspection 

Path to Widespread Adaptive Test Revealed at CAST Workshop

By Tom Morrow, chief marketing officer, SEMI on November, 2013 [0]
Adaptive test has been identified as the most essential test process and methodology change needed to achieve lower test costs by the latest release of the ITRS.
Other Tags:  Software 

HVM Handler Evaluation Shows 20k-Unit MCBJ

By Rick Nelson on November, 2013 [0]
In an evaluation on an HVM test floor in Asia, Multitest's MT2168 achieved superior ratings in five of six categories, including 5% higher.
Other Tags:  News 

Imec Demonstrates III-V Compound FinFET Devices

By Rick Nelson on November, 2013 [0]
Devices are Monolithically Integrated on 300-mm Silicon Wafers; Technology Achievement Marks Significant Step Towards Monolithic Heterogeneous Integration and Non-silicon Devices.
Other Tags:  Key Technologies 

FEI Announces High-Throughput TEM Sample Preparation Workflow

By Rick Nelson on November, 2013 [0]
ExSolve Enables Semiconductor and Data Storage Manufacturers to Obtain More Information Faster and at Lower Cost for Process Verification.
Other Tags:  Inspection 

Presto Engineering Tests Ultra-Wideband and Impulse Radar Devices

By Rick Nelson on November, 2013 [0]
Proprietary capabilities implemented on the load board permit low-cost functional testing at speed/frequency without major capital expenditure.
Other Tags:  News 

Triton Gets Funding to Manufacture Glass Interposers

By Rick Nelson on November, 2013 [0]
Triton Microtechnologies receives funding to ramp up manufacturing of glass interposers for next-generation semiconductor packaging; company Invests $3.2 million in U.S. Facility.
Other Tags:  News 

SPI System Software Optimized for 3-D Calculation

By Rick Nelson on October, 2013 [0]
At productronica, GOEPEL will highlight its OptiCon SPI-Line 3D solder paste inspection (SPI) system and introduce new SPI-Pilot 1.4 integrated system software.
Other Tags:  Inspection 

Pickering Expands Range of PXI RF Solid-State 6-GHz Multiplexers

By Rick Nelson on October, 2013 [0]
Pickering Interfaces is expanding its range of PXI RF solid state 6-GHz switching solutions with the introduction of two new multiplexer (mux) versions.
Other Tags:  Instrumentation 

LPKF Introduces Laser Source for UV PCB Depaneling Systems

By Rick Nelson on October, 2013 [0]
LPKF Laser & Electronics has announced the availability of a new, higher-powered laser source option for its MicroLine family of UV laser circuit board depaneling systems.
Other Tags:  News 

Obtain Test IP from the Cloud

By Rick Nelson, Executive Editor on November, 2013 [201311]
Advantest's CloudTesting Service offers test IP that you can license on a monthly basis. All you need to do is prepare your load board or socket.
Other Tags:  Key Technologies 

TU Delft and imec Address Test of 3D Stacked ICs

By Rick Nelson on October, 2013 [0]
Delft University of Technology and nanoelectronics research center imec have presented 3D-COSTAR, a new test-flow cost-modeling tool for 2.5/3D stacked integrated circuits.
Other Tags:  News 

Panel topics range from abalones to robots

By Rick Nelson on October, 2013 [0]
Excess capacity, energy, robotics, employment, and the manufacturing expertise of abalones were all topics of conversation at a panel discussion in Cambridge, organized by 89.7 WGBH radio.
Other Tags:  Automotive/Vehicle Test 

EAG Expands Microelectronic Test and Engineering Services

By Rick Nelson on October, 2013 [0]
Company offers system failure analysis to target need to find and fix electronics system failures that can cause costly downtime, product recalls, and reputational damage.
Other Tags:  Inspection 

A 20-nm node by any other name would be as large

By Rick Nelson on October, 2013 [0]
What's in a process-node metric: 20 nm, 16 nm, 14 nm? Such measurements are becoming fictional, according to Mentor Graphics CEO Wally Rhines.
Other Tags:  Ricks Blog 

Computers are coming for 47% of our jobs

By Rick Nelson on September, 2013 [0]
Computers are coming for our jobs, or at least nearly half of them, according to a paper from Oxford University.
Other Tags:  Automotive/Vehicle Test 

Marvin Test Solutions elaborates on armament test gap

By Rick Nelson on September, 2013 [0]
At Autotestcon last week, Steve Sargeant, Major General, USAF (Ret.), and CEO, Marvin Test Solutions, discussed the armament test gap. This week, Marvin Test Solutions released additional information on bridging the gap.
Other Tags:  Military / Aero Test 

Chinese Government Suspends Cyanide-Gold Plating Ban

By Rick Nelson on September, 2013 [0]
On September 23, 2013, the National Development and Reform Commission (NDRC) of China issued a circular postponing the implementation of the regulation that would have eliminated cyanide-gold plating at the end of 2014.
Other Tags:  Key Technologies 

Synthetic instruments make inroads with RF applications

By Tom Lecklider on September, 2013 [0]
Are we there yet with synthetic instruments? Autotestcon panelists answer yes, no, and maybe.
Other Tags:  Military / Aero Test 

Autotestcon panelists cite opportunities and challenges of the new military

By Rick Nelson on September, 2013 [0]
A panel at Autotestcon provided an opportunity for executives to comment on the challenges and opportunities afforded by such factors as sequestration, ATE standardization efforts, and public/private partnerships.
Other Tags:  Military / Aero Test 

ITC keynoter comments on 75-GFLOPS/W compute target

By Rick Nelson on September, 2013 [0]
Performance and reliability are increasingly interdependent, according to Pradip Bose at IBM In a Thursday morning ITC address titled "Efficient Resilience in Future Systems: Design and Modeling Challenges," he described the an IBM-led DARPA PERFECT project.
Other Tags:  Software 

ITC keynoter addresses nonlinear validation challenge

By Rick Nelson on September, 2013 [0]
Verification and validation are key aspects of supporting a brand and providing customers with a better user experience, according to John D. Barton, vice president of the platform engineering group at Intel, who delivered a keynote speech titled "Compute Continuum and the Nonlinear Validation Challenge" at ITC.
Other Tags:  Software 

GOEPEL and iSYSTEM Develop Integrated Validation and Test Platform

By Rick Nelson on September, 2013 [0]
At ITC GOEPEL and iSYSTEM announced they have developed an integrated platform for software and hardware validation and test.
Other Tags:  Software 

JTAG Technologies Highlights JTAG Live Products at ITC

By Rick Nelson on September, 2013 [0]
JTAG Technologies BV showcased several JTAG Live products as well as new systems upgrades at this years' International Test Conference in Anaheim.
Other Tags:  Software 

GOEPEL Debuts Automatic Application Program Generator

By Rick Nelson on September, 2013 [0]
At ITC, GOEPEL introduced an Automatic Application Program Generator (AAPG) for design validation and test of FPGA integrated high-speed I/O (HSIO) based on the ChipVORX technology for FPGA Embedded Instruments.
Other Tags:  Software 

NVIDIA adopts OT tools to help the imaginary appear real

By Rick Nelson on September, 2013 [0]
Craig Nishizaki, director of ATE development at NVIDIA, took advantage of the International Test Conference held here this week to deliver a talk titled "Leveraging Cross-Operational Test Data for Manufacturing Yield and DPPM/RMA Improvements."
Other Tags:  Software 

Synopsys Debuts DesignWare STAR Hierarchical System to Accelerate SoC Test

By Rick Nelson on September, 2013 [0]
Significantly Reduces Test Integration Time and Improves Test QoR for Hierarchical SoCs
Other Tags:  Software 

Open-Silicon Improves Test Quality with Tessent Cell-Aware Test

By Rick Nelson on September, 2013 [0]
Mentor Graphics Corp. announced at the International Test Conference that ASIC design company Open-Silicon has used the Tessent TestKompress product with Cell-Aware Test to improve test quality of SoC designs.
Other Tags:  Software 

Synopsys Announces DFTMAX Ultra to Reduce Silicon Test Costs

By Rick Nelson on September, 2013 [0]
Customers Realizing Up to 3x Higher Compression with Fewer Test Pins
Other Tags:  Software 

Test is not a passing fad

By Rick Nelson on September, 2013 [0]
Test is not a passing fad-it's a driver of the world economy, according to Gordon Roberts, general chair of the International Test Conference
Other Tags:  Communications Test 

LTX-Credence Announces Agreement to Purchase Multitest and ECT

By Rick Nelson on September, 2013 [0]
Acquisition of Multitest and Everett Charles Technologies Creates New Company with a Vision Based on Combined Expertise to Support Full Test Cell
Other Tags:  News 

North American PCB Sales and Orders Trending Upward

By Rick Nelson on September, 2013 [0]
IPC has announced the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and order growth both continued trending upward.
Other Tags:  News 

Agilent Introduces Its First High-Power System Power Supplies

By Rick Nelson on September, 2013 [0]
Agilent has introduced two high-power system power-supply families: The Advanced Power System (APS) family offers 1- and 2-kW power supplies, and the N8900 Series provides programmable, 5-, 10- and 15-kW power supplies with autoranging outputs.
Other Tags:  Instrumentation 

imec Progresses Toward 7 nm and Below

By Rick Nelson, Executive Editor on September, 2013 [201309]
imec is making significant progress toward 7-nm and below semiconductor process technologies.
Other Tags:  Key Technologies 

LXI Test System for Missile Launcher

By Fred Bloennigen, Ph.D., LXI Consortium on September, 2013 [201309]
An LXI-based test system ensures that missiles in the DoD's ground-based defense system receive the correct signals and fire only when launched.
Other Tags:  Instrumentation 

Addressing Environmental Concerns

By Rick Nelson, Executive Editor on September, 2013 [201309]
Environmental concerns were front and center at SEMICON West 2013 as evidenced by a new product, a presentation, and an environmental award.
Other Tags:  Key Technologies 

Test Vendors Support MIL/Aero Upgrades

By Rick Nelson, Executive Editor on September, 2013 [201309]
Military/aerospace applications benefit from flexible, interoperable test systems that span the lifetimes of the systems they target.
Other Tags:  Military / Aero Test 

UC Riverside Researchers Advance Resistive Memory

By Rick Nelson on August, 2013 [0]
Researchers develop novel way to build resistive memory devices that could become the storage part of the next generation of smart phones and tablets.
Other Tags:  Key Technologies 

Future Memory Technology for the Terabit Era

By Jan Van Houdt on August, 2013 [0]
At the imec technology forum held July 8 in San Francisco in conjunction with SEMICON West, Jan Van Houdt, director of the flash memory program, discussed emerging memory technologies. Here, he provides a brief summary of his presentation.
Other Tags:  Key Technologies 

Cascade Microtech and imec Successfully Probe Micro-bumps

By Rick Nelson on August, 2013 [0]
Breakthrough probing results, achieved with CM300 probe system, enable 3D IC market progress.
Other Tags:  News 

IECQ CAP Wages War Against Counterfeit Components

By Rick Nelson on July, 2013 [0]
Danger to life and property: In response to the need of the electronics supply chain, IECQ, the IEC Quality Assessment System for Electronic Components, launched a program to address the international counterfeit crisis faced by the aerospace, defense, and high-performance (ADHP) sectors.
Other Tags:  Military / Aero Test 

DAS addresses semiconductor-industry environmental concerns

By Rick Nelson on July, 2013 [0]
Representatives of DAS Environmental Expert GmbH were at SEMICON West to provide an overview of their company and to preview a new product.
Other Tags:  Key Technologies 

Mobile devices leave PCs in the dust

By Rick Nelson on July, 2013 [0]
Mobility is a key driver in the semiconductor space, and smartphones have become dominant vs. PCs, according to Henry Blodget of Business Insider.
Other Tags:  Communications Test 

OEM Chip Spending Returns to Growth as Apple and Samsung Battle

By Rick Nelson on July, 2013 [0]
After a flat 2012, global purchasing of semiconductors by top electronic brands is set to return to growth in 2013, as Apple and Samsung contend to claim the title of biggest spender.
Other Tags:  Communications Test 

Visibility boosts design and test

By Rick Nelson on July, 2013 [0]
When it comes to the design and test of hardware and software, it's all about visibility, according to Glenn Woppman, president and CEO of ASSET InterTech.
Other Tags:  Software 

Manocha describes Foundry 2.0 at SEMICON West

By Rick Nelson on July, 2013 [0]
SEMICON West is like the All Star Game, said Ajit Manocha, CEO of GLOBALFOUNDRIES, in his keynote address at SEMICON West. Semiconductor equipment and materials players bring their best game, and attendees choose the best of the best.
Other Tags:  Ricks Blog 

Imec Addresses 3-D ICs, Interconnects, Cryogenic Etching, and Solar Cells

By Rick Nelson on July, 2013 [0]
Imec is collaborating with Dow Corning on 3-D IC packaging technologies, has developed a manganese-based self-formed barrier (SFB) process that improves interconnect performance, and described a cryogenic etching method.
Other Tags:  Key Technologies 

Teradyne J750Ex-HD Addresses Cost of Test for SoCs

By Rick Nelson on July, 2013 [0]
Teradyne at SEMICON West announced the immediate availability of the J750Ex-HD production test system.
Other Tags:  Software 

Advantest Highlights CloudTesting Service

By Rick Nelson on July, 2013 [0]
Advantest chose SEMICON West to highlight its CloudTesting Service for the North American market.
Other Tags:  Software 

Flextronics CTO charts course to smart everything

By Rick Nelson on July, 2013 [0]
Erik Volkerink, Ph.D., chief technology officer of Flextronics, offered his perspective on global technology to attendees of the Test Vision 2020 Workshop, held in conjunction with SEMICON West.
Other Tags:  Medical Test 

Imec looks to make the unexpected happen

By Rick Nelson on July, 2013 [0]
Imagine that you could assemble a team consisting of a brilliant physicist, an entrepreneur with character, a genuine marketer, a pioneer, a go-getter, a chemist, a businessman, a trendsetter, and a steady hand.
Other Tags:  Medical Test 

ASSET Acquires Arium to Boost System Development Visibility

By Rick Nelson on July, 2013 [0]
Arium's Intel and ARM hardware-assisted debug tools will be integrated into ASSET's ScanWorks platform for debug, validation, and test.
Other Tags:  Software 

SEMI Sees 21% Increase in Chip Equipment Spending for 2014

By Rick Nelson on July, 2013 [0]
Mid-year forecast for chip equipment industry shows improving outlook says SEMI at SEMICON West.
Other Tags:  News 

Pickering Electronics to Present at Semicon West

By Rick Nelson on July, 2013 [0]
Pickering Electronics, the manufacturer of reed relays for instrumentation and automatic test equipment (ATE), will exhibit its line of surface mount, single-in-line (SIL), dual-in-line (DIL), and package-style products.
Other Tags:  Instrumentation 

SenarioTek Announces New Santa Rosa Facility

By Rick Nelson on July, 2013 [0]
The larger space integrates research, development, and manufacturing for the continued expansion of the switch matrix, frequency converter, and calibration product lines.
Other Tags:  News 

Dynamic Test Solutions Merges with MC Test Products

By Rick Nelson on July, 2013 [0]
Dynamic Test Solutions (DTS) and MC Test Products have merged to better serve their combined global customer base. Both Companies design and fabricate ATE test hardware.
Other Tags:  News 

Datest Completes Recertification Audit for ISO 9001/AS9100C

By Rick Nelson on June, 2013 [0]
Datest, which offers PCBA testing, test engineering, and inspection services, announced that it passed its recertification audit for its dual ISO 9001/AS9100C Certification.
Other Tags:  Military / Aero Test 

SV Probe Acquires Assets from Tokyo Cathode Laboratory

By Rick Nelson on June, 2013 [0]
Acquisition Enhances SV's Technical Probing Offerings
Other Tags:  News 

Rudolph Announces the JetStep Panel Lithography System

By Rick Nelson on June, 2013 [0]
Unique stepper design is driven by the semiconductor advanced packaging transition from wafer to panel manufacturing.
Other Tags:  News 

Foundries Choose FormFactor's Copper Pillar Probing Solutions

By Rick Nelson on June, 2013 [0]
Apollo MF100 Delivers MEMS Technology that Enables Copper Pillar Packaging Applications at Pitches of 100 µm and Below.
Other Tags:  News 

Imec Technology Forum US to Address Cost and Complexity

By Rick Nelson, Executive Editor on June, 2013 [0]
The relationship between IC technology and the cost and complexity of systems will be a theme of the Imec Technology Forum US, held July 8 in conjunction with SEMICON West.
Other Tags:  Inspection 

Embracing LXI and PXI for Switching

By David Owen, Pickering Interfaces on July, 2013 [201307]
There is no best platform for switching; the LXI and PXI standards bring different advantages and disadvantages depending on the application.
Other Tags:  LXI/PXI/VXI 

Cost of Test Reduction Through Optimized Asset Utilization

By John Wilcox, Teradyne on July, 2013 [201307]
Test engineers can use both concurrent and multisite test methodologies to determine the most cost-effective allocation of resources.
Other Tags:  Instrumentation 

Acculogic Releases Version 5.4 of Integrator Software

By Rick Nelson on June, 2013 [0]
Acculogic announced the release of version 5.4 of its Integrator Software, the system for Acculogic's Flying Probe FLS Series.
Other Tags:  News 

Agilent Announces Compliance with RoHS Directive

By Rick Nelson on June, 2013 [0]
Agilent Technologies has announced that the majority of its electronic test and measurement products are now designed for compliance with the EU RoHS restrictions ahead of 2017 deadline.
Other Tags:  Instrumentation 

IEEE 1149.1-2013 aims to slash costs through test reuse

By Rick Nelson, Executive Editor on June, 2013 [0]
The IEEE 1149.1-2013 "Standard for Test Access Port and Boundary-Scan Architecture" aims to cut costs by means of test reuse from IP to the system level, said CJ Clark, Intellitech CEO and chairman of the IEEE 1149.1-2013 working group.
Other Tags:  Software 

Intellitech Supports Silicon Instruments through IEEE 1149.1-2013 Standard

By Rick Nelson on June, 2013 [0]
Intellitech announced support for accessing "Silicon Instruments" through the new IEEE 1149.1-2013 JTAG standard.
Other Tags:  Software 

GOEPEL Introduces Video Dragon for Infotainment Components

By Rick Nelson on June, 2013 [0]
GOEPEL electronic has introduced Video Dragon (basicCON 4121) for the test of high-speed LVDS connections and HDMI interfaces found in infotainment components.
Other Tags:  Inspection 

Agilent Boundary Scan Analyzer Supports Intel Silicon View Technology

By Rick Nelson on June, 2013 [0]
Agilent Technologies has announced that Intel Silicon View Technology (Intel SVT) is now supported in the Agilent x1149 boundary scan analyzer.
Other Tags:  Instrumentation 

Agilent Enhances Parameter Analyzer

By Rick Nelson on June, 2013 [0]
Agilent has announced source/monitor unit (SMU) and software enhancements to its B1500A semiconductor device analyzer.
Other Tags:  Instrumentation 

250-W Power Supply is Convection-Cooled

By Rick Nelson on June, 2013 [0]
Convection-Cooling Eliminates Fan Maintenance and Audible Noise.
Other Tags:  Instrumentation 

Imec Technology Forum US 2013

By Rick Nelson on June, 2013 [0]
Imec Technology Forum US 2013: Learn from the top R&D experts how to make the best choices in IC technology.
Other Tags:  Industry Events 

Workshop coverage extends from software to ATE gesture interfaces

By Rick Nelson, Executive Editor on June, 2013 [0]
Test Vision 2020 will cover a range of topics, from a voice/gesture ATE interface to the role of software, according to Ajay Khoche, general chair, and Pete Hodakievic, program chair.
Other Tags:  Software 

Test Vision 2020 and the IEEE TTTC Issue Call for Best ATE Paper

By Rick Nelson on June, 2013 [0]
Test Vision 2020 and the IEEE TTTC are now accepting recommendations for a paper published in 2012 that contributed to the advancement of the ATE field.
Other Tags:  News 

Imec and GLOBALFOUNDRIES Collaborate on Memory Technology

By Rick Nelson on May, 2013 [0]
STT-MRAM offers enhanced performance and scalability for embedded and standalone applications.
Other Tags:  News 

Test Vision 2020 to Address Test Strategies, Technologies, and Applications

By Rick Nelson on May, 2013 [0]
Annual Test Workshop to be Held in Conjunction with SEMICON West.
Other Tags:  Instrumentation 

B&K Precision Expands 1U System Power Supply Offerings

By Rick Nelson on May, 2013 [0]
B&K Precision expanded its DC system power supply offerings with the Model 9115 multirange programmable DC power source.
Other Tags:  Instrumentation 

GOEPEL Integrates JTAG and Mixed-Signal Test in One Chip

By Rick Nelson on May, 2013 [0]
GOEPEL electronic has introduced CION LX, a JTAG transceiver IC that offers tester-per-pin architecture based on IEEE 1149 and provides ultralow voltage characteristics.
Other Tags:  Instrumentation 

Small-cell Wi-Fi topic is EE-News reader favorite

By Rick Nelson on May, 2013 [0]
Commentary on small cells with Wi-Fi was the most popular item among readers of Wednesday's EE-News, EE-Evaluation Engineering's weekly email newsletter.
Other Tags:  Communications Test 

History lesson: chips and oil don't mix

By Rick Nelson, Executive Editor on May, 2013 [0]
Remember Exxon's foray into the semiconductor business? How about Schlumberger's incursion into semiconductor test? As an EE-Evaluation Engineering reader you're more likely to remember the latter, and it was only ten years ago that Schlumberger exited the business by spinning off NPTest.
Other Tags:  Software 

KACST Launches WaferCatalyst Silicon Prototyping Services

By Rick Nelson on May, 2013 [0]
King Abdulaziz City for Science and Technology (KACST), the Kingdom of Saudi Arabia's National Science Agency & National Laboratories, has announced the launching of its WaferCatalyst prototyping and small-volume production services.
Other Tags:  Software 

GOEPEL Initiates Cooperation Network with EMS Companies

By Rick Nelson on May, 2013 [0]
JTAG/boundary-scan company GOEPEL announced a comprehensive cooperation network with contract manufacturers called the EMS Partner Program.
Other Tags:  Instrumentation 

Addressing New Silicon Test Challenges with IJTAG

By Stephen Pateras, Mentor Graphics on June, 2013 [201306]
: P1687, together with the daisy-chained TAPs recommended by the P1838 working group, now supports 3-D IC test.
Other Tags:  Software 

AMETEK, Maccor Partner on Energy Storage Device Test

By Rick Nelson on May, 2013 [0]
AMETEK has entered into an agreement with Maccor, a manufacturer of ATE for batteries, capacitors, fuel cells, and other energy storage devices.
Other Tags:  Instrumentation 

Cascade's Ahlgren Offers Clear View of Semiconductor Test

By Rick Nelson, Executive Editor on June, 2013 [201306]
As process nodes shrink and QC concerns grow, semi manufacturers will need to test early and often according to Cascade Microtech's Debbora Ahlgren.
Other Tags:  Software 

Compact 800-W Programmable Power Supply Features Digital Controls

By Rick Nelson on May, 2013 [0]
TDK expanded TDK-Lambda's Z+ Series of programmable power supplies, which now includes new 800-W bench-top and rack-mount models.
Other Tags:  Instrumentation 

Multitest ecoAmp Kelvin Contactor Serves High Power Application

By Rick Nelson on May, 2013 [0]
Multitest announced that its ecoAmp high-power Kelvin contactor successfully passed an evaluation for a high-power automotive application at a European-based IDM.
Other Tags:  News 

Coto Technology Debuts MEMS-Based Magnetic Reed Switch

By Rick Nelson on May, 2013 [0]
MEMS Technology Enables High Performance in an RedRock Ultraminiature Magnetic Reed Switch Package.
Other Tags:  Instrumentation 

GOEPEL Opens System Cascon for Third-Party Tools

By Rick Nelson on May, 2013 [0]
In cooperation with selected partners within its GATE Alliance Program, GOEPEL electronic has developed an Inter Process Link (IPL) for its System Cascon JTAG/boundary-scan software platform.
Other Tags:  Software 

Electric vehicle post is EE-News reader favorite

By Rick Nelson, Executive Editor on May, 2013 [0]
Commentary on electric vehicle technology was the most popular item among readers of Wednesday's EE-News, EE-Evaluation Engineering's weekly email newsletter.
Other Tags:  Automotive/Vehicle Test 

Board test, inspection, and programming get boost

By Rick Nelson, Executive Editor on April, 2013 [0]
GOEPEL announced electrical test and inspection capabilities aimed at PCBs and board-resident programmable devices: an AOI system, an inline test and programming system, and a desktop tester/programmer.
Other Tags:  Inspection 

Big Data Comes to Semiconductor Test

By Tom Morrow, vice president, SEMI on April, 2013 [0]
While the term "big data" originated in the IT world and the Web for storing and analyzing large distributed aggregations of loosely structured data, it is now becoming a critical issue in the future of semiconductor test.
Other Tags:  Software 

Semicon West Participants Offer Updates on EUV, 3-D Transistors, and 450-mm Manufacturing

By Rick Nelson on April, 2013 [0]
The critical processes and technologies necessary to continue Moore's Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing, according to SEMI.
Other Tags:  Inspection 

IPC Drives Member Success

By Rick Nelson, Executive Editor on May, 2013 [201305]
The new president /CEO of IPC says an association must be about its members and has launched an initiative to focus on customer success.
Other Tags:  Inspection 

Ascentech Offers Aprotec Z-Check 3D Benchtop SPI Systems

By Rick Nelson on April, 2013 [0]
Ascentech LLC, distributor for Aprotec Instrumentation, has announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems.
Other Tags:  Inspection 

Software innovations span design through manufacturing

By Rick Nelson, Executive Editor on April, 2013 [0]
Recent software innovations from Intusoft, CadSoft, and Averna have yielded products that run the gamut from design through manufacturing.
Other Tags:  Software 

Georgia Tech wins DARPA contract on 3-D IC cooling and reliability

By Rick Nelson, Executive Editor on April, 2013 [0]
Georgia Tech reports that is has won a 3-year, $2.9 million DARPA contract to develop 3-D chip cooling technology.
Other Tags:  Ricks Blog 

Smartphones' Rise Limits Growth Opportunities for Outsourced Manufacturers

By Rick Nelson on April, 2013 [0]
Outsourced manufacturers now face a diminished growth outlook, as mobile communications brands increasingly opt to manufacture smartphones on their own, according to IHS.
Other Tags:  Communications Test 

Averna Releases Proligent 6.2 Test and Quality Management Software

By Rick Nelson on April, 2013 [0]
Averna, a test solution provider to electronics and communications OEMs, announced Release 6.2 of its Proligent Test and Quality Management software.
Other Tags:  Software 

Leading Indicators Offer Optimism for North American PCB Sales

By Rick Nelson on April, 2013 [0]
While North American manufacturing begins a slow recovery and leading indicators point to modest business expansion in the coming months, the PCB industry has not yet felt the effects of this turnaround.
Other Tags:  News 

Aegis Software Brings Paperless Flow to Analytic Systems

By Rick Nelson on April, 2013 [0]
Aegis Software has announced that Analytic Systems has recently purchased an Aegis Software package comprising iView, iTrack, iQ, and iMonitor.
Other Tags:  Software 

SPEA and ISE Labs Announce Partnership for MEMS Testing

By Rick Nelson on April, 2013 [0]
SPEA and ISE Labs have announced that ISE has selected the SPEA MEMS Test Cell as its turnkey solution for MEMS testing.
Other Tags:  News 

400-W Quarter Brick Converters Feature 95% Efficiency

By Rick Nelson on April, 2013 [0]
TDK Corp. has announced the TDK-Lambda iQG Series of DC/DC converters, which are suitable for intermediate or distributed-bus power architectures.
Other Tags:  Instrumentation 

Test Vision 2020 Issues Call for Papers

By Rick Nelson on April, 2013 [0]
Test Vision 2020 will convene July 10-11, 2013, in San Francisco in conjunction with Semicon West.
Other Tags:  Software 

Test Vision 2020

By Rick Nelson on March, 2013 [0]
Test Vision 2020: 6th IEEE International Workshop on Test Equipment
Other Tags:  Software 

IPC International Technology Roadmap Takes New Directions

By Rick Nelson on March, 2013 [0]
The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that is occurring throughout the electronics industry: more cooperation and information sharing.
Other Tags:  News 

VOICE 2013

By Rick Nelson on March, 2013 [0]
VOICE 2013 Conference
Other Tags:  Industry Events 

BiTS presentation demystifies burn-in and test sockets

By Rick Nelson, Executive Editor on March, 2013 [0]
Test sockets can be complex, according to Paul F. Ruo, VP of sales and marketing at Aries Electronics, in a presentation at the March 3-8 BiTS Workshop.
Other Tags:  Environmental Test 

NAND Flash Market Defies Trends and Grows to Record Level in Q4

By Rick Nelson, Executive Editor on March, 2013 [0]
The global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.
Other Tags:  News 

VTS 2013

By Rick Nelson, Executive Editor on March, 2013 [0]
31st IEEE VLSI Test Symposium
Other Tags:  Industry Events 

Reliability Screening for Electromechanical Relays

By Phil Roettjer, Relay Testing Services on April, 2013 [201304]
Initial screening to receive outliers has been shown to greatly improve relay reliability.
Other Tags: None.

GOEPEL Extends VarioTAP Emulation to Energy Micro Giant Gecko

By Rick Nelson, Executive Editor on March, 2013 [0]
GOEPEL announced the introduction of VarioTAP emulation-technology model libraries for the Energy Micro EFM32GGxxx microcontroller series.
Other Tags:  Instrumentation 

Melexis Chooses Multitest's MT9510 Test Handler for Gesture Recognition IC

By Rick Nelson, Executive Editor on March, 2013 [0]
Multitest announced that Melexis has chosen Multitest's Standard MT9510 Pick and Place Test Handler for an infrared, light sensing application.
Other Tags:  News 

GOEPEL Demonstrates ESA with Zynq-7000 SoC at Embedded World

By Rick Nelson, Executive Editor on February, 2013 [0]
At Embedded World 2013 in Nuremberg, Germany, GOEPEL demonstrated programming and test strategies based on its Embedded System Access (ESA) technologies.
Other Tags:  Software 

Rise of Smartphones Reshapes Competitive Order in Chip Market

By Rick Nelson, Executive Editor on February, 2013 [0]
The competitive landscape of the cellphone core IC business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.
Other Tags:  Communications Test 

Burn-in & Test Strategies Workshop (BiTS) 2013

By Rick Nelson, Executive Editor on February, 2013 [0]
Burn-in & Test Strategies Workshop (BiTS) 2013
Other Tags:  Industry Events 

IPC APEX EXPO convenes in San Diego

By Rick Nelson, Executive Editor on February, 2013 [0]
IPC APEX EXPO convenes this week in San Diego, where vendors will exhibit a variety of printed-circuit-board and assembly test and inspection systems.
Other Tags:  Software 

From JTAG to X-ray, test and inspection innovations abound at APEX

By Rick Nelson, Executive Editor on February, 2013 [0]
IPC APEX concluded with companies having exhibited test and inspection and related software products, while IPC's president and CEO outlined initiatives for the coming year.
Other Tags:  Inspection 

IPC's Mitchell Emphasizes Members' Technical and Financial Success

By Rick Nelson, Executive Editor on February, 2013 [0]
An association must be about its members. That's the view of John W. Mitchell, D.Ed., president and CEO of IPC—Association Connecting Electronics Industries
Other Tags:  Military / Aero Test 

MatriX Presents Inline X-ray and CT Systems to U.S. Market

By Rick Nelson, Executive Editor on February, 2013 [0]
Munich-based MatriX Technologies introduced its inline inspection systems to the U.S. market at APEX . It also highlighted the XCT-1000S CT system.
Other Tags:  Inspection 

Agilent Launches Bench-top Boundary Scan Analyzer

By Rick Nelson, Executive Editor on February, 2013 [0]
Agilent Technologies Inc. has announced the launch of the Agilent x1149 boundary-scan analyzer at IPC APEX EXPO.
Other Tags:  Instrumentation 

Electronics Contract Manufacturing Business Set for 4.5% Growth This Year

By Rick Nelson, Executive Editor on February, 2013 [0]
Despite lingering weakness in the global economy and continuing uncertainty in technology markets, the outsourced manufacturing industry is expected to post moderate revenue growth this year.
Other Tags:  News 

Aegis Software Launches FactoryLogix Suite

By Rick Nelson, Executive Editor on February, 2013 [0]
Aegis Software, a provider of integrated manufacturing solutions, said it will launch its all new FactoryLogix suite at IPC APEX EXPO.
Other Tags:  Software 

GOEPEL Offers Entry-Level Boundary Scan Bundle

By Rick Nelson, Executive Editor on February, 2013 [0]
GOEPEL electronic said it now provides a special JTAG/boundary-scan package for beginners or for users with cost-sensitive projects.
Other Tags:  Instrumentation 

APEX Special Events Target Science, Technology, Networking

By Rick Nelson, Executive Editor on February, 2013 [0]
Among the APEX EXPO special events is a free opening keynote by Dr. Michio Kaku, known for popularizing physics through his Discovery Channel specials and best-selling books.
Other Tags:  Inspection 

Nonintrusive Test Complements ATE to Meet PCB Test Needs

By Rick Nelson, Executive Editor on January, 2013 [0]
Experts comment on PCB test techniques including ICT, FCT, vectorless test, and nonintrusive boundary-scan-based techniques.
Other Tags:  Software 

Electronics New England 2013

By Rick Nelson, Executive Editor on February, 2013 [0]
Electronics New England 2013
Other Tags:  Inspection 

Productronica

By Rick Nelson, Executive Editor on February, 2013 [0]
Productronica
Other Tags:  Instrumentation 

International Test Conference 2013

By Rick Nelson, Executive Editor on February, 2013 [0]
International Test Conference
Other Tags:  Software 

IPC APEX EXPO

By Rick Nelson, Executive Editor on February, 2013 [0]
IPC APEX EXPO
Other Tags:  Inspection 

Semicon West

By Rick Nelson, Executive Editor on February, 2013 [0]
Semicon West 2013
Other Tags:  Inspection 

International Test Conference Call for Papers

By Rick Nelson, Executive Editor on February, 2013 [0]
International Test Conference Call for Papers
Other Tags:  Software 

Agilent to Exhibit at IPC APEX EXPO

By Rick Nelson, Executive Editor on February, 2013 [0]
Agilent said it will demonstrate a boundary scan analyzer plus inline in-circuit and functional test systems at the IPC APEX EXPO, February 19-21 in San Diego.
Other Tags:  Software 

ECT to Present Probers and Connectors at IPC APEX EXPO

By Rick Nelson, Executive Editor on February, 2013 [0]
Everett Charles Technologies (ECT) announced plans to exhibit at the upcoming IPC APEX EXPO, February 19-21, 2013, in San Diego.
Other Tags:  News 

Seica to Exhibit at IPC APEX EXPO

By Rick Nelson, Executive Editor on February, 2013 [0]
Seica will exhibit at APEX the Pilot V8 flying prober, the Firefly laser selective soldering system, and the Compact TK functional and in-circuit test system.
Other Tags:  Software 

PMBusProg Supports In-System Programming of Power-Management Devices

By Rick Nelson, Executive Editor on February, 2013 [0]
JTAG Technologies is offering a Power Management Bus (PMBus) IC programming tool that supports devices from vendors Linear Technology and Texas Instruments.
Other Tags:  Software 

Data Capture Pod from Diagnosys Generates Functional Test Programs

By Rick Nelson, Executive Editor on February, 2013 [0]
The New Data Capture Pod from Diagnosys gives you a fast and efficient tool for generating functional test programs boards and components.
Other Tags:  News 

GE to Show Solder Joint Inspection System at APEX

By Rick Nelson, Executive Editor on February, 2013 [0]
A 3D CT option of GE’s phoenix x|aminer microfocus X-ray inspection system will be displayed at Measurement & Control's booth at IPC APEX EXPO.
Other Tags:  Inspection 

ASTER Technologies Offers New TestWay Release

By Rick Nelson, Executive Editor on February, 2013 [0]
A new release of ASTER Technologies' TestWay supports DfX. The new release incorporates an integrated workflow from design to product delivery.
Other Tags:  Software 

Magna-Power Debuts 1.5- to 4-kW 1U Programmable DC Supplies

By Rick Nelson, Executive Editor on February, 2013 [0]
Magna-Power released to production its new SL Series 1U (1.75”)-high programmable DC power supplies.
Other Tags:  Instrumentation 

The robots are coming, and they're looking for jobs

By Rick Nelson, Executive Editor on February, 2013 [0]
Robotics and related technologies may be driving inequality as robots compete with skilled and unskilled workers.
Other Tags:  Automotive/Vehicle Test 

Imec Teams With Cadence on DFT Solution for 3-D Memory-on-Logic

By Rick Nelson, Executive Editor on January, 2013 [0]
At the European 3D TSV Summit, imec and Cadence said they have implemented and validated an automated 3D DFT solution to test interconnects in DRAM-on-logic stacks.
Other Tags:  Software 

Presentation at European 3D TSV Summit charts road to IC test

By Rick Nelson, Executive Editor on January, 2013 [0]
The evolution of from SoCs and sensors onto 3-D ICs is presenting quality and test challenges, according to James Quinn, VP of sales and marketing at Multitest.
Other Tags:  Key Technologies 

Researcher pursues bottom-up approach to semiconductor miniaturization

By Rick Nelson, Executive Editor on January, 2013 [0]
If top-down lithography approaches to IC fabrication stall, a chemistry-based bottom-up approach may help.
Other Tags:  Ricks Blog 

Product Innovations Aid MEMS Design and Test

By Rick Nelson, Executive Editor on February, 2013 [201302]
Whether designing a MEMS or developing a COTS MEMS-based system, products introduced over the past six months support your efforts.
Other Tags:  Instrumentation 

Administration Plans National Network for Manufacturing Innovation

By Rick Nelson, Executive Editor on January, 2013 [0]
The National Science and Technology Council released a report that describes an approach to implementing a National Network for Manufacturing Innovation (NNMI).
Other Tags:  News 

PVA Tepla and Imec Demonstrate 3-D TSV Void Detection using GHz SAM

By Rick Nelson, Executive Editor on January, 2013 [0]
Imec and PVA Tepla presented results regarding the detection of TSV voids in 3-D stacked ICs using scanning acoustic microscopy.
Other Tags:  Inspection 

Pickering Expands PXI Solid-State MUX Line

By Rick Nelson, Executive Editor on January, 2013 [0]
Pickering Interfaces announced it is expanding its range of solid-state PXI versatile multiplexers with the introduction of the 40-683.
Other Tags:  LXI/PXI/VXI 

NI Releases Automated Test Outlook 2013

By Rick Nelson, Executive Editor on January, 2013 [0]
National Instruments' ATO 2013 examines business strategies, architectures, computing, software, and I/O influencing electronics-based industries.
Other Tags:  Instrumentation 

Does manufacturing test add value?

By Rick Nelson, Executive Editor on January, 2013 [0]
Rich Yerganian of LTX-Credence comments on whether test adds value or is simply an unavoidable cost center.
Other Tags:  Communications Test 

MIT's p-type transistor offers improved carrier mobility

By Rick Nelson, Executive Editor on January, 2013 [0]
Researchers at the MIT's Microsystems Technology Laboratories (MTL) have developed a germanium p-type transistor whose carrier mobility doubles that of previous experimental p-type transistors.
Other Tags:  Ricks Blog 

IPC, SEMI Release November Results

By Rick Nelson, Executive Editor on December, 2012 [0]
In Nov., North America-based semiconductor equipment manufacturers posted a 0.79 book-to-bill ratio, and the combined PCB industry book-to-bill ratio declined to 0.93.
Other Tags:  News 

Rick's Picks—100 Hot Products of 2012

By Rick Nelson, Executive Editor on December, 2012 [0]
Year-end brings the opportunity to look back at new products and product enhancements introduced in 2012--here are my choices for the top 100.
Other Tags:  Instrumentation 

Cycling Toward the Future

By Rick Nelson, Executive Editor on January, 2013 [201301]
In the future, we can expect to ride a cycle of vision, innovation, disruption, and reaction, according to the 2012 ITC keynote address.
Other Tags:  Communications Test 

Execs Describe FormFactor's MicroProbe Acquisition

By Rick Nelson, Executive Editor on January, 2013 [201301]
Aiming to become the largest probe-card manufacturer in the industry, FormFactor acquired MicroProbe in October 2012.
Other Tags:  EE Executive Insight 

Nighthawk tackles cost of RF test

By Rick Nelson, Executive Editor on December, 2012 [0]
With its new Nighthawk brand, LTX-Credence has a new strategy for testing single-radio connectivity devices.
Other Tags:  Communications Test 

LTX-Credence Debuts Low Cost System for Connectivity Devices

By Rick Nelson, Executive Editor on December, 2012 [0]
LTX-Credence announced its first Nighthawk product for testing high-volume price-sensitive RF connectivity devices.
Other Tags:  Instrumentation 

Forecasts and results indicate persistent economic weakness

By Rick Nelson, Executive Editor on December, 2012 [0]
The semiconductor, equipment, and printed-circuit-board markets reflect economic weakness, according to reports from IHS iSuppli, IPC, and SEMI.
Other Tags:  Ricks Blog 

SEMI Forecasts 2012 Semiconductor Equipment Sales

By Rick Nelson, Executive Editor on December, 2012 [0]
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $38.2 billion in 2012.
Other Tags:  News 

IHS Downgrades Semiconductor Industry Forecast

By Rick Nelson, Executive Editor on December, 2012 [0]
Amid weak economic conditions that are depressing consumer and business spending on electronics, IHS is downgrading its forecast for the global semiconductor market in 2012.
Other Tags:  News 

IPC Releases October PCB Results

By Rick Nelson, Executive Editor on December, 2012 [0]
IPC—Association Connecting Electronics Industries announced the Oct. findings from its North American Printed Circuit Board (PCB) Statistical Program.
Other Tags:  News 

GOEPEL Debuts G-TAP Contacting for Assembly Test

By Rick Nelson, Executive Editor on November, 2012 [0]
GOEPEL introduced G-TAP, which can perform versatile contacting of electronic assemblies via the JTAG bus for testing and programming.
Other Tags:  Instrumentation 

CAST Elects New Leadership to Address Semiconductor Test

By Rick Nelson, Executive Editor on November, 2012 [0]
The Collaborative Alliance for Semiconductor Test (CAST) has elected new leadership to advance its mission to develop advances in semiconductor test.
Other Tags:  News 

Global Test Solutions Offers DL Series Electronic DC Loads

By Rick Nelson, Executive Editor on November, 2012 [0]
Global Test Solutions has announced that it now offers the DL Series electronic direct-current (DC) loads from NF Corp.
Other Tags:  Instrumentation 

Pickering Offers LXI Scalable and Modular Matrix

By Rick Nelson, Executive Editor on November, 2012 [0]
Pickering Interfaces is expanding its range of LXI switching solutions with the introduction of the 65-110 LXI Wideband Modular Matrix.
Other Tags:  Instrumentation 

TDK-Lambda Expands Z+ Series Programmable DC Power Supplies

By Rick Nelson, Executive Editor on November, 2012 [0]
TDK Corporation has announced the expansion of TDK-Lambda's Z+ Series of DC programmable power supplies, which now include 200-W models.
Other Tags:  Instrumentation 

Aeroflex Announces Test System for Analog In-circuit and Functional Test

By Rick Nelson, Executive Editor on November, 2012 [0]
Aeroflex Ltd. announced that it now offers its 5800 Series multi-functional test system with a Virginia Panel interface.
Other Tags:  Instrumentation 

ITC topics extend from jitter measurement to board and system test

By Tom Lecklider, Senior Technical Editor on November, 2012 [0]
Panels, corporate presentations; sessions on jitter and phase noise, new-generation ATE, board and system test, and scan compression; and commentary on IJTAG were all highlights of ITC.
Other Tags:  Software 

Principles of Analog In-Circuit Testing

By Anthony J. Suto, Teradyne on December, 2012 [201212]
In-circuit testing uses guarding to isolate a DUT from other components to which it is connected, allowing the DUT resistance to be measured.
Other Tags: None.

ATE: Making Electronics Practical

By Tom Lecklider, Senior Technical Editor on December, 2012 [201212]
Over the years, authoritative articles by recognized experts helped position EE as a trusted test-engineering resource.
Other Tags:  50 Years of Test Technology 

Execs describe FormFactor's MicroProbe acquisition at ITC

By Rick Nelson, Executive Editor on November, 2012 [0]
Aiming to become the largest probe-card manufacturer in the industry, FormFactor acquired MicroProbe in October 2012.
Other Tags:  Ricks Blog 

SCOUT Interfaces Now Available with Integral Fixture Table

By Rick Nelson, Executive Editor on November, 2012 [0]
MAC Panel has announced the availability of SCOUT interfaces with an integral fixture table.
Other Tags:  Instrumentation 

EDA firms tout IJTAG, memory test and repair

By Rick Nelson, Executive Editor on November, 2012 [0]
IJTAG and memory test and repair were key topics highlighted by Mentor Graphics and Synopsys, respectively, at this year's International Test Conference.
Other Tags:  Software 

3-D IC test workshop caps ITC activities

By Rick Nelson, Executive Editor on November, 2012 [0]
A workshop on 3-D IC test capped Test Week activities held in conjunction with the International Test Conference.
Other Tags:  Software 

OptimalTest Highlights OptimalEnterprise Version 5 at ITC

By Rick Nelson, Executive Editor on November, 2012 [0]
OptimalTest chose the International Test Conference to highlight its new OptimalEnterprise Version 5 release.
Other Tags:  Software 

Mentor Debuts IJTAG Embedded Instrumentation

By Rick Nelson, Executive Editor on November, 2012 [0]
Mentor Graphics announced at the International Test Conference its new IEEE P1687 Tessent IJTAG solution.
Other Tags:  Software 

Synopsys Highlights Memory Test and Repair Solution at ITC

By Rick Nelson, Executive Editor on November, 2012 [0]
Synopsys announced DesignWare STAR Memory System 5, an automated pre- and post-silicon memory test, debug, diagnostic and repair solution.
Other Tags:  Software 

CEOs address innovation at ITC

By Rick Nelson, Executive Editor on November, 2012 [0]
CEOs of key test companies addressed International Test Conference attendees at a Monday evening panel.
Other Tags:  Software 

Bud Offers IP65 Dual-Compartment Enclosures

By Rick Nelson, Executive Editor on November, 2012 [0]
Bud Industries debuted its DCH dual-compartment IP65 enclosures with an upper compartment that has an easily-removable, transparent cover.
Other Tags:  Instrumentation 

Aegis Software Enables Paperless Defect Mapping at Sechan

By Rick Nelson, Executive Editor on October, 2012 [0]
Aegis Software said Sechan Electronics chose Aegis' Quality System as a replacement for Sechan's paper-based defect mapping process.
Other Tags:  Software 

Boundary-Scan Controller Offers Wireless LAN Interface

By Rick Nelson, Executive Editor on October, 2012 [0]
GOEPEL announced the SFX/WSL1149-(x), which the company calls the world's first JTAG/boundary-scan controller for Wireless LAN (WLAN).
Other Tags:  Instrumentation 

Design for Test Tools Address Stacked Dies

By Rick Nelson, Executive Editor on November, 2012 [201211]
3-D ICs presents test challenges extending from DFT tools device handlers.
Other Tags: None.

Trends for Microcontroller Device Testing

By Jeremy Campbell, Teradyne on January, 2012 [201201]
This article discusses in detail the application of power supplies that trade voltage for current within a maximum power envelope to ensure the optimum power source for each DUT pin.
Other Tags:  Automotive/Vehicle Test 

Does manufacturing need special help?

By Rick Nelson, Executive Editor on February, 2012 [0]
Recently released figures from the Bureau of Labor Statistics show a predicted loss of 73,000 manufacturing jobs over the period from 2010 and 2020.
Other Tags:  Automotive/Vehicle Test 

Elevating the Test Function

By Rick Nelson, Executive Editor on March, 2012 [201203]
In its 2012 Automated Test Outlook, National Instruments identifies five key trends.
Other Tags:  LXI/PXI/VXI 

Modular Market Drives a Disruptive Change

By Larry Desjardin, Modular Methods on May, 2012 [201205]
In this article, an industry expert argues that the pace of adoption is accelerating, resulting in truly disruptive change.
Other Tags:  Automotive/Vehicle Test 

IPC and JPCA Develop Standard for Printed Electronics Industry

By Rick Nelson, Executive Editor on July, 2012 [0]
In a joint effort, IPC and JPCA have released the first operational-level standard for the rapidly evolving printed-electronics industry.
Other Tags:  Automotive/Vehicle Test 

CSZ Offers HALT and HASS Testing Services

By Rick Nelson, Executive Editor on August, 2012 [0]
Cincinnati Sub-Zero (CSZ) Testing Services has announced it now offers HALT (highly accelerated life testing) and HASS (highly accelerated stress screening) testing.
Other Tags:  Environmental Test 

Embedded Test Complements Boundary Scan

By Rick Nelson, Executive Editor on October, 2012 [201210]
Companies specializing in circuit board and system design-for-test (DFT) tools are pursuing a variety of strategies to serve test and debug applications.
Other Tags:  Instrumentation 

Charting the Design-and-Test Future

By Rick Nelson, Executive Editor on November, 2012 [201211]
The relationship between design and test is becoming more critical in applications involving military systems readiness, embedded systems design, and 3-D IC test.
Other Tags:  Instrumentation 

IPC: World EMS Market Continues to Recover

By Rick Nelson, Executive Editor on October, 2012 [0]
Following economic setbacks in 2009, the world market for EMS continued to recover in 2011 and 2012, according to an annual study by IPC.
Other Tags:  News 

GOEPEL Combines Boundary Scan with NI FlexRIO

By Rick Nelson, Executive Editor on October, 2012 [0]
GOEPEL said it has developed a boundary-scan option for NI PXI/PXIe FlexRIO cards, enabling the utilization of the FPGA-based FlexRIO as a JTAG I/O module.
Other Tags:  Instrumentation 

OS bridges embedded-system design-creation and production-test gap

By Rick Nelson, Executive Editor on October, 2012 [0]
Kozio aims to help embedded-system hardware designers speed products to market with VTOS Builder
Other Tags:  Software 

AMETEK Highlights Water-Cooled Supplies at Autotestcon

By Rick Nelson, Executive Editor on September, 2012 [0]
AMETEK Programmable Power at Autotestcon 2012 featured its Sorensen ASD Series 40-V and 60-V precision programmable AC/DC power supplies.
Other Tags:  Instrumentation 

Pickering Highlights PXI and LXI

By Rick Nelson, Executive Editor on September, 2012 [0]
Pickering Interfaces at Autotestcon 2012 showcased new products in both the LXI and PXI platforms.
Other Tags:  Instrumentation 

JTAG Technologies Showcases Products at Autotestcon

By Rick Nelson, Executive Editor on September, 2012 [0]
JTAG Technologies showcased its latest developments and products for military and aerospace applications at Autotestcon 2012.
Other Tags:  Instrumentation 

Autotestcon panelists chart design-and-test future

By Rick Nelson, Executive Editor on September, 2012 [0]
The world is a messy place filled with unpleasant surprises, necessitating a powerful military to respond appropriately, according to Bob Rassa of Raytheon.
Other Tags:  Instrumentation 

TDK-Lambda Unveils 150- and 240-W Power Supplies

By Rick Nelson, Executive Editor on September, 2012 [0]
TDK Corporation has announced the new TDK-Lambda ZWS-BP series of compact, open-frame, 150-W and 240-W power supplies.
Other Tags:  Instrumentation 

ChipVORX Technology Extended to Altera Arria V FPGAs

By Rick Nelson, Executive Editor on September, 2012 [0]
GOEPEL electronic has announced the availability of the first ChipVORX model libraries for the new generation of Arria V GX FPGA devices from Altera.
Other Tags:  Instrumentation 

SEMI Launches 450 Central Site for Wafer Transition Information

By Rick Nelson, Executive Editor on August, 2012 [0]
SEMI has announced the introduction of 450 Central, a web-based information service to help the semiconductor industry efficiently transition to 450-mm-ready solutions.
Other Tags:  News 

GOEPEL Makes Boundary Scan Applications Interference-Free

By Rick Nelson, Executive Editor on August, 2012 [0]
GOEPEL electronic has introduced the TAP-Isolator, a special module to improve interference immunity in serial scan operations.
Other Tags:  Instrumentation 

Rethink Robotics hopes to do for manufacturing what the PC did for the office

By Rick Nelson, Executive Editor on August, 2012 [0]
Rethink Robotics Inc. is poised to introduce a new generation of robots that will improve productivity in manufacturing environments.
Other Tags:  Ricks Blog 

Vendors Drive IC Advancements

By Rick Nelson, Executive Editor on September, 2012 [201209]
Semicon West and Test Vision 2020 focused on key developments in today's semiconductor industry.
Other Tags: None.

JTAG Technologies Debuts PXIe Boundary-scan Controller

By Rick Nelson, Executive Editor on August, 2012 [0]
JTAG Technologies, a provider of solutions for testing and programming high-density PCBs, has announced a further extension to its line of high-performance boundary-scan IEEE Std. 1149.1 controllers.
Other Tags:  Instrumentation 

IPC Study Predicts On-Shoring Impact

By Rick Nelson, Executive Editor on August, 2012 [0]
Electronics manufacturing operations with a total value of at least $2.5 billion are expected to be brought to North America in the next three years.
Other Tags:  News 

Community College Boosts MEMS Commercialization

By Rick Nelson, Executive Editor on August, 2012 [0]
MEMS technology commercialization is getting a boost with the establishment of the Richard Desich SMART Commercialization Center for Microsystems at Lorain County Community College in Ohio.
Other Tags:  Ricks Blog 

Multitest Addresses 3-D IC Packages

By Rick Nelson, Executive Editor on July, 2012 [0]
Multitest, a designer and manufacturer of final-test handlers, contactors, and load boards used by integrated device manufacturers (IDMs) and final test subcontractors, has announced that its first Multitest Plug & Yield solution for the test of 3-D packages recently has been released to a customer's production line.
Other Tags:  News 

Malefactors expected to attack 3-D ICs

By Rick Nelson, Executive Editor on July, 2012 [0]
Al Crouch told Test Vision 2020 attendees that 3-D ICs will present test and security challenges that must be addressed now.
Other Tags:  Instrumentation 

Advantest Touts 3-D Handling Technologies at Semicon West

By Rick Nelson, Executive Editor on July, 2012 [0]
Advantest at Semicon West highlighted the development of a new product line of fully automated and integrated test and handling solutions for TSV-based 2.5-D and 3-D products.
Other Tags:  Instrumentation 

Aries Highlights Top-Load Socket at Semicon West

By Rick Nelson, Executive Editor on July, 2012 [0]
Aries Electronics announced in conjunction with Semicon West that it now offers a top-load burn-in socket that saves significant time and money (over conventional top-load sockets) for new IC pin-out designs.
Other Tags:  Environmental Test 

Geotest Highlights New Capabilities of TS-900 PXI System

By Rick Nelson, Executive Editor on July, 2012 [0]
Geotest at Semicon West highlighted the expanded capabilities of its TS-900 platform, which now offers a a new manipulator option and automated-handler-compatible receiver.
Other Tags:  Instrumentation 

Imec Announces Innovations at Semicon West

By Rick Nelson, Executive Editor on July, 2012 [0]
Imec chose Semicon West to announce breakthroughs in sub-100-nm photonics components and large-area industrial-level silicon solar cells.
Other Tags:  Inspection 

Keynoter describes ubiquitous computing from data center to pacemaker

By Rick Nelson, Executive Editor on July, 2012 [0]
This year represents a critical juncture for the semiconductor industry, as organizations look to 3-D IC packaging, extreme ultraviolet (EUV) lithography, and 450-mm wafers.
Other Tags:  Communications Test 

SEMI Announces Mid-year Forecast for Chip Equipment Industry

By Rick Nelson, Executive Editor on July, 2012 [0]
SEMI projects semiconductor equipment sales will reach $42.4 billion in 2012 according to the mid-year edition of the SEMI Capital Equipment Forecast.
Other Tags:  News 

Modular Instruments Address IC Test

By Rick Nelson, Executive Editor on July, 2012 [201207]
PXI, PXIe, and AXIe modules are making inroads into semiconductor test as vendors introduce modules suitable for IC test.
Other Tags: None.

GOEPEL Supports JTAG Platform Cable USB II from Xilinx

By Rick Nelson, Executive Editor on June, 2012 [0]
In cooperation with Xilinx, GOEPEL has developed a new software option to support Xilinx's Platform Cable USB II.
Other Tags:  Software 

March Products

By Evaluation Engineering on March, 2012 [201203]
Products for March 2012
Other Tags:  Inspection 

May Products

By Evaluation Engineering on May, 2012 [201205]
Products for May 2012
Other Tags:  EMC/ESD 

Reducing Defect Rates With Cell-Aware Testing

By Friedrich Hapke, Mentor Graphics, and Michael Reese and Jason Rivers, Advanced Micro Devices on June, 2012 [201206]
The cell-aware methodology relates several variables as well as cell layout and improves test coverage.
Other Tags: None.

Addressing New Requirements for Legacy Test Stations

By Peter Hansen, Teradyne, Assembly Test Division on June, 2012 [201206]
A structured subsystem can be an effective alternative to replacement of legacy ATE or ad hoc augmentation.
Other Tags: None.

Advantest Debuts T5511 High-Speed Memory Test System

By Rick Nelson, Executive Editor on May, 2012 [0]
Advantest Corp. has announced the availability of its next-generation high-speed DRAM test system, the T5511.
Other Tags:  News 

GOEPEL Debuts FPGA JTAG I/O Modules

By Rick Nelson, Executive Editor on May, 2012 [0]
GOEPEL electronics has introduced ChipVORX Module, an FPGA based I/O module product line.
Other Tags:  Instrumentation 

Events address PXI for IC test, BRIC test markets

By Rick Nelson, Executive Editor on May, 2012 [0]
May events include one addressing PXI for IC test and another covering growth opportunities in the test-equipment market in the BRIC countries.
Other Tags:  Instrumentation 

Protocol-Aware ATE Digital Instruments

By John Aslanian, Teradyne on May, 2012 [201205]
In the latest ATE, programmable protocol-aware engines support communications with the DUT in its own language, greatly simplifying test and facilitating multisite applications.
Other Tags: None.

Kelvin Sensing Cuts Measurement Errors

By Rick Nelson, Executive Editor on May, 2012 [201205]
Many bench instruments support Kelvin measurements, but applying the technique to semiconductor production test poses some challenges.
Other Tags: None.

JTAG Partners With Sanmina-SCI

By Rick Nelson, Executive Editor on April, 2012 [0]
JTAG Technologies, a provider of IEEE 1149.x boundary-scan test equipment, has announced that Sanmina-SCI will be using JTAG's boundary scan tools.
Other Tags:  Software 

ASSET's Board Bring-Up Solution Debugs Haswell

By Rick Nelson, Executive Editor on April, 2012 [0]
ASSET ScanWorks platform for embedded instruments can structurally verify, functionally test, analyze performance margins, and debug boards based on Intel Haswell.
Other Tags:  Software 

Advantest Completes Integration of Verigy

By Rick Nelson, Executive Editor on April, 2012 [0]
Advantest has announced the successful completion of integration activities relating to its acquisition of Verigy Ltd. in July 2011.
Other Tags:  Instrumentation 

Keithley Enhances S530 Parametric Test Systems

By Rick Nelson, Executive Editor on March, 2012 [0]
Keithley Instruments Inc. has enhanced the capabilities of its S530 parametric test systems for high-speed production parametric test.
Other Tags:  Instrumentation 

Multitest Launches Contactor for High-End Digital Applications

By Rick Nelson, Executive Editor on March, 2012 [0]
Multitest, a designer and manufacturer of final test handlers, contactors, and load boards used by integrated device manufacturers (IDMs) and final test subcontractors, has launched the newest member of the Quad Tech contactor family
Other Tags:  News 

GOEPEL Accelerates Boundary Scan for Multiple Boards

By Rick Nelson, Executive Editor on March, 2012 [0]
GOEPEL electronic has announced the availability of a new "Board Merger" function within the frame of its SYSTEM CASCON boundary-scan software.
Other Tags:  Software 

Pickering Electronics Debuts High-Voltage Reed Relays

By Rick Nelson, Executive Editor on March, 2012 [0]
Pickering Electronics' new Series 104 high-voltage reed relays feature instrumentation-grade reed switches.
Other Tags:  Instrumentation 

Semiconductor ATE targets ASSPs

By Rick Nelson, Executive Editor on March, 2012 [0]
LTX-Credence launched the Diamondx semiconductor test system, targeted at ASSP (application specific standard products) and complex microcontrollers.
Other Tags:  Communications Test 

PXI Express Controller Features Intel Core i5 Processor

By Rick Nelson, Executive Editor on March, 2012 [0]
National Instruments has announced the NI PXIe-8115 high-performance 3U embedded controller featuring a dual-core second-generation Intel Core i5 processor.
Other Tags:  Instrumentation 

IDI Launches Two Semiconductor Test Offerings

By Rick Nelson, Executive Editor on March, 2012 [0]
Interconnect Devices Inc. has announced the launch of two patent-pending products in its semiconductor test line.
Other Tags:  News 

GOEPEL Software Targets ESA

By Rick Nelson, Executive Editor on March, 2012 [0]
Version 4.6 of GOEPEL electronic's SYSTEM CASCON boundary-scan software platform holistically supports all Embedded System Access (ESA) technologies.
Other Tags:  Software 

GOEPEL Joins ARM Connected Community

By Rick Nelson, Executive Editor on March, 2012 [0]
GOEPEL electronic announced it is a new member in the ARM Connected Community, the industry's largest ecosystem of ARM technology-based products and services.
Other Tags:  News 

GOEPEL electronic Demonstrates Evaluation Kit for Embedded System Access

By Rick Nelson, Executive Editor on March, 2012 [0]
GOEPEL electronic has introduced ESA Coach, an evaluation and training kit supporting Embedded System Access (ESA) technologies.
Other Tags:  Instrumentation 

March EE highlights mil/aero ATE, LTE, smart power, more

By Rick Nelson, Executive Editor on March, 2012 [0]
Our March issue, now online, includes features on mil/aero ATE, LTE test, smart power, semiconductor yield enhancement, AXIe, PXI, remote monitoring, and signal generation.
Other Tags:  Instrumentation 

Elevating the test function

By Rick Nelson, Executive Editor on February, 2012 [0]
National Instruments' 2012 Automated Test Outlook identifies five trends in instrumentation.
Other Tags:  Instrumentation 

Three Degrees of Board Testing Product Focus

By Tom Lecklider, Senior Technical Editor on January, 2010 [201001]
As PCB component density has increased, many more new designs are based on boundary scan-enabled parts because physical access has virtually disappeared.
Other Tags: None.

Optimizing Maintenance For Turbine Engines

By Mitchell Wlodawski and Bill Pankracij, DSPCon on January, 2010 [201001]
For years, the defense and military communities have been faced with increasing pressure to incorporate advanced Prognostic Health Management (PHM) solutions into high-value turbine jet engines.
Other Tags: None.

A Solution for Testing Battery Management Systems

By David Owen and Bob Stasonis, Pickering Interfaces; and Brent Hoerman, DMC Engineering on April, 2010 [201004]
It's not a good idea to use actual batteries to test hybrid vehicle electrical systems because it's not easy to insert and vary known faults, the voltages can be very high, and the possibility of damage is large. Instead, Pickering Interfaces, in conjunction with DMC Engineering, has developed the 41-752 six-channel battery simulator that supports safety-interlocked emulation of a Li-ion battery stack with approximately 100 cells. David Owen and Bob Stasonis, Pickering Interfaces; Brent Hoerman, DMC Engineering (April 2010)
Other Tags: None.

Improving Semiconductor Yield With Scan Diagnosis

By by Geir Eide, Mentor Graphics on March, 2010 [201003]
Because the underlying source of a yield problem can manifest itself in different ways and locations, identifying it requires greater insight than typically needed for failure analysis. Geir Eide, product marketing manager for Silicon Test Solutions at Mentor Graphics, discusses the layout-aware aspect of fault diagnosis that helps pinpoint the most likely cause among a group of candidates. Geir Eide, Mentor Graphics (March 2010)
Other Tags: None.

Switching RF and Microwave signals

By Tom Lecklider, Senior Technical Editor on May, 2010 [201005]
Notwithstanding large advances in the performance of electronic switches, electromechanical relays remain the best choice for most RF and microwave test applications. Tom Lecklider, senior technical editor, examines the characteristics that make this so as well as the advantages and limitations associated with alternative technologies. Tom Lecklider, Evaluation Engineering (May 2010)
Other Tags: None.

Exploring Concurrent Test Efficiency

By Randy Kramer, Teradyne on July, 2010 [201007]
Concurrently testing the various functional blocks within an IC is a practical way to improve test efficiency beyond that achievable through multisite testing alone. The extent of the improvement depends on the IC design partitioning as well as the ATE characteristics. Randy Kramer from Teradyne develops and discusses efficiency metrics based on both of these factors. Randy Kramer, Teradyne (July 2010)
Other Tags: None.

One Show for All

By Paul Milo on February, 2011 [201102]
One Show for All
Other Tags:  LXI/PXI/VXI 

LXI and Other Test Platforms

By David Owen and Bob Stasonis, Pickering Interfaces on January, 2011 [201101]
The reasons for choosing one test platform over another are varied and include instrument obsolescence; increased test capabilities; size, ease of use, and cost; and simple evolution of test objectives to match changing product needs. A series of actual applications presented by David Owen and Bob Stasonis of Pickering Interfaces helps to distinguish among those attributes that GPIB, PXI, VXI, and LXI systems and modules provide as well as demonstrate the usefulness of hybrid cross-platform solutions. David Owen, Bob Stasonis, Pickering Interfaces (January 2011)
Other Tags:  LXI/PXI/VXI 

Scalable Common Core for Automated Test Systems

By Jon N. Semancik, VTI Instruments on January, 2011 [201101]
ATE systems comprise several types of instruments together with controlling software, but regardless of the specific tests performed, the core of most systems includes switching, signal conditioning, synchronized I/O, and hardware interfaces. Basing systems on open-architecture hardware and software improves their scalability and ensures a smooth transition when hardware becomes obsolete or can no longer address expanded test requirements. Jon Semancik, VTI Instruments (January 2011)
Other Tags:  Military / Aero Test