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EE-news March 8, 2012

In This Issue

March EE Highlights MIL/Aero ATE, LTE, Smart Power, More

Nanofiber Breakthrough Holds Promise for Medicine and Microprocessors

Empowering Oscilloscopes to Measure GaN

New Software Responds to Students’ Emotions, Boredom

Bluetooth Is Not Just for Headsets

Traditional Runner-Up Takes Top Spot in Consumer MEMS Market


March EE Highlights MIL/Aero ATE, LTE, Smart Power, More

by Rick Nelson

EE-Evaluation Engineering's March issue, now online, includes features on MIL/Aero ATE, LTE test, smart power, semiconductor yield enhancement, AXIe, PXI, remote monitoring, signal generation, and more.

Our special report discusses the issues involved in determining whether to upgrade or replace MIL/Aero ATE systems while our cover story focuses on the test equipment available to help roll out LTE networks while maintaining compatibility with 2G and 3G networks.

Visit Rick's Blog for the complete article >

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Nanofiber Breakthrough Holds Promise for Medicine and Microprocessors

A new method for creating nanofibers made of proteins, developed by researchers at Polytechnic Institute of New York University (NYU-Poly), promises to greatly improve drug delivery methods for the treatment of cancers, heart disorders, and Alzheimer's disease as well as aid in the regeneration of human tissue, bone, and cartilage.

In addition, applied differently, this same development could point the way to even tinier and more powerful microprocessors for future generations of computers and consumer electronics devices.

Visit NYU-Poly for the complete article >

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Empowering Oscilloscopes to Measure GaN

by Rick Nelson

One of the hottest segments in electronics design and test these days is power. That is Tektronix Technical Marketing Engineer Randy White's takeaway from the Applied Power Electronics Conference last month. Conference participants, White said, were looking to boost efficiencies and reduce power losses by moving to new semiconductor materials.

Silicon, White said, is reaching its performance limits, and it's no longer cost-effective to try to squeeze out 3% or 4% better performance through fab and process improvements. Consequently, power electronics companies are moving to technologies including silicon carbide (SiC) and gallium nitride (GaN).

Visit Rick's Blog for the complete article >

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New Software Responds to Students’ Emotions, Boredom

by Susan Guibert

Emotion-sensing computer software that models and responds to students’ cognitive and emotional states—including frustration and boredom—has been developed by University of Notre Dame Assistant Professor of Psychology Sidney D’Mello, Art Graesser from the University of Memphis, and a colleague from Massachusetts Institute of Technology. D’Mello also is a concurrent assistant professor of computer science and engineering.

The new technology, which matches the interaction of human tutors, not only offers tremendous learning possibilities for students, but also redefines human-computer interaction.

Visit Notre Dame for the complete article >

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Bluetooth Is Not Just for Headsets

by Patrick Nelson

With cable-and-wire spaghetti proliferating in and around our homes and offices, threatening to consume our devices and us in the end, it may be time to take a look at Bluetooth wireless technology, which is great if you can get it to work.

Headsets protruding awkwardly from an ear is the typical Bluetooth image that comes to mind. More unusual applications include data tracking—like a planned Bluetooth-enabled data-tracking pressure sensor in Nike training shoes and an upcoming Bluetooth toothbrush.

Visit TechNewsWorld for the complete article >

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Traditional Runner-Up Takes Top Spot in Consumer MEMS Market

by Rick Nelson

According to IHS iSuppli, gyroscopes held the top position as revenue generators in 2011 in the dominant consumer and mobile segment of the microelectromechanical systems (MEMS) market. The research firm reports the devices netted $655.4 million in 2011, up 66% from $394.5 million in 2010, displacing accelerometers.

IHS iSuppli says gyroscopes will continue in the top spot over the next few years, taking in $1.1 billion by 2015, ahead of accelerometers at $705 million. IHS iSuppli attributes the success of gyroscopes to the boom in 3-axis versions of the device, used mostly in tandem with 3-axis accelerometers for more accurate motion sensing.

Visit Rick's Blog for the complete article >

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Special Offers from EE

Set-up any kind of real-world signal with just a single instrument - download free application notes

The versatile 4-in-1 Agilent 81160A pulse function arbitrary noise generator addresses noise and jitter emulation, Ethernet, SATA, radar, and nanotechnology applications and now lets you set up any kind of real-world signal with just a single instrument.

Find out yourself and download free application notes. >

NI PXI vs Traditional Box Instruments

The National Instruments PXIe-5665 Vector Signal Analyzer offers industry-leading performance in both speed and accuracy. Combining the flexibility and modularity of the PXI platform with the NI PXIe-5665, opens a whole new range of tests you couldn’t perform before. See why NI PXI is a leading modular instrumentation standard.

Watch the video. >

ADLINK All-Hybrid, 9-Slot PXI Express Chassis

ADLINK’s new PXES-2590 is the industry’s first all-hybrid, 9-slot PXI Express chassis, providing up to 8 GB/s throughput and offering a flexible solution that allows engineers to use both PXI and PXIe modules. PXES-2590 is efficient and low-maintenance, with cooling and alarms that reduce power consumption and extend product life.

Learn more >

Commercial-Off-The-Shelf RF & Microwave Switch Solutions

Dow-Key unveils its next- generation RF matrix engineered toward a modular and reconfigurable platform with added software features for controlling the matrix and developing user-specific scripts & software. Along with 50-ms system level switching speed, the platform isn’t only more cost-effective but also more easily repairable and field upgradable.

Learn more. >

Aries’ CSP Test Socket Uses Probe & Spring Design

Aries’ CSP test and burn-in sockets use a unique, cost-effective “probe and spring” design that provides a short, reliable signal path. The contact system consists of an interposer set of just two elements the probe and the spring, and can be customized for different device types and sizes.

Click here for more information >

Ruggedized in-vehicle data acquisition

Compact in-vehicle data acquisition system with eight 200 kS/s FLEXIBLE input channels, plus two CAN BUS interfaces and GPS inputs. Runs from 8-30 VDC, from cigarette lighter. Includes GPS antenna GPS receiver of 1, 20 or 100 Hz. Powerful software for acquisition plus UNLIMITED FREE analysis license seats.

Click here for more information >

Register Today for the IEEE MTT-S IMS2012!

Register now to receive the lowest available rates! The International Microwave Symposium (IMS2012) will be held June 17th- 22nd in Montreal, Canada. IMS2012 will feature a 3-day exhibit in addition to world-class technical sessions, workshops and panels discussions. A plenary talk by Steven Mollenkopf, of Qualcomm entitled “3G/4G Chipsets and the Mobile Data Explosion” on Monday night is a highlight of Microwave Week that is not to be missed. Microwave Week also includes the Radio-Frequency Integrated Circuit Symposium and the Automatic Radio-Frequency Techniques Group Conference.

Register now at ims2012.mtt.org! >


                      


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